Method of manufacturing a multilayer printed wiring board for providing an electronic component therein

Abstract

A multilayer printed wiring board and method for manufacturing a multilayer printed wiring board. One method include a method for manufacturing a multilayer printed wiring board having an electronic component housed therein. The method includes forming a conduction circuit on a core substrate and forming an alignment mark on the core substrate separate from the conduction circuit. Also included is forming a concavity in the core substrate, the concavity being formed in an area of the core substrate not including the conductor circuit and alignment mark, and inserting the electronic component into the concavity in the core substrate by using the alignment mark on the core substrate to align the electronic component with the concavity.

1 . A multilayer printed wiring board comprising:
 a core substrate having a concavity formed therein;   an electronic component having a connection terminal and housed within the concavity in the core substrate;   at least one interlayer insulating layer provided on the core substrate and on the electronic component such that the electronic component is embedded within the multilayer printed wiring board;   a conductor provided on a surface of the interlayer insulating layer;   at least one via structure electrically connecting the conductor of the interlayer insulating layer with the connector terminal of the electronic component; and   at least one alignment mark embedded within the multilayer printed wiring board, the at least one alignment mark not being electrically connected to the connection terminal and not being electrically connected to the conductor, wherein the alignment mark provides a mechanism for aligning the electronic component with the concavity during assembly of the multilayer printed wiring board.   
     
     
         2 . The multilayer printed wiring board of  claim 1 , wherein said at least one alignment mark comprises a first alignment mark on a first surface of the core substrate; and a second alignment mark on a second surface of the core substrate, said second surface opposing the first surface. 
     
     
         3 . The multilayer printed wiring board of  claim 2 , wherein said at least one interlayer insulating layer comprises a first interlayer insulating layer on the first surface of the core substrate and a second interlayer insulating layer provided on the second surface of the core substrate. 
     
     
         4 . The multilayer printed wiring board of  claim 1 , wherein said electronic component comprises an integrated circuit (IC) chip. 
     
     
         5 . The multilayer printed wiring board of  claim 4 , wherein said IC chip comprises another alignment mark provided on a surface of the IC chip. 
     
     
         6 . The multilayer printed wiring board of  claim 4 , wherein said IC chip comprises an intermediate conductor layer provided on a pad of the IC chip. 
     
     
         7 . The multilayer printed wiring board of  claim 6 , wherein the intermediate conductor layer of the IC chip is larger than the pad. 
     
     
         8 . The multilayer printed wiring board of  claim 4 , wherein said IC chip comprises a redistribution layer provided thereon. 
     
     
         9 . The multilayer printed wiring board of  claim 1 , wherein said electronic component comprises a chip capacitor.