Molding device and method for molding a nut into a cover

Abstract

A method for molding a nut into a cover of an electronic device is provided. The nut includes a chassis defining a threaded blind hole therein. The method includes the following steps: providing a core mold, the core mold including a molding surface and a recess defined in the molding surface; placing the nut on the core mold with the chassis fittingly engaged in the recess; creating a negative pressure within the recess to firmly secure the chassis in the recess; attaching a cavity mold to the core mold, the cavity mold and the core mold cooperatively forming a molding cavity receiving the nut therein; and injecting molding material into the molding cavity to form the cover with the nut embedded therein. A molding device for molding the nut into the cover is also provided.

1 . A method for molding a nut into a cover of an electronic device, the nut comprising a chassis defining a threaded blind hole therein, the method comprising:
 providing a core mold, the core mold including a molding surface and a recess defined in the molding surface;   placing the nut on the core mold with the chassis fittingly engaged in the recess;   creating a negative pressure within the recess to firmly secure the chassis in the recess;   attaching a cavity mold to the core mold, the cavity mold and the core mold cooperatively forming a molding cavity receiving the nut therein; and   injecting molding material into the molding cavity to form the cover with the nut embedded therein.   
     
     
         2 . The method as described in  claim 1 , wherein the core mold comprises a post formed on a bottom of the recess, and the post is inserted into the blind hole. 
     
     
         3 . The method as described in  claim 1 , wherein the core mold includes a plurality of holes defined in the molding surface in the recess, the holes is configured for connection to a vacuum pump to create the negative pressure. 
     
     
         4 . A molding device for molding a nut into a cover, the molding device comprising:
 a cavity mold; and   a core mold, the core mold and the cavity mold cooperatively defining a molding cavity, the core molding including a molding surface in the molding cavity, a recess defined in the molding surface, and at least one suction hole defined in a bottom of the recess, the core mold including a post protruding from the bottom of the recess and protruding beyond the molding surface.   
     
     
         5 . The molding device as described in  claim 4 , wherein the at least one suction hole comprises a plurality of holes, and the holes are arranged along a plurality of imaginary circles. 
     
     
         6 . The molding device as described in  claim 5 , wherein the imaginary circles are concentric.