Adaptive heat dissipating device

Abstract

An adaptive heat dissipating device includes a heat-transfer element and a heat-dissipation element. An end of the heat-transfer element is a spherical body, and an end of the heat-dissipation element is a semispherical socket for correspondingly receiving the spherical body therein, such that the spherical body is rotatably connected to the semispherical socket. Therefore, the heat-transfer element has enough degrees of freedom to rotate in different directions and pitch at different angles relative to the heat-dissipation element. With these arrangements, the adaptive heat dissipating device can have largely upgraded heat dissipation efficiency and increased flexibility in application.

1 . An adaptive heat dissipating device, comprising:
 a heat-transfer element having a main body, a heat absorbing section provided on the main body, a first connecting section connected at an end to the main body, and a spherical body connected to another end of the first connecting section opposite to the main body; and   a heat-dissipation element having a base, a heat radiating section provided on the base, a second connecting section connected at an end to the base, and a semispherical socket connected to another end of the second connecting section opposite to the base, such that the spherical body is rotatably received in and connected to the semispherical socket.   
     
     
         2 . The adaptive heat dissipating device as claimed in  claim 1 , wherein the heat radiating section includes a plurality of radiating fins, and the radiating fins being selected from the group consisting of pin fins and straight fins. 
     
     
         3 . The adaptive heat dissipating device as claimed in  claim 1 , wherein the heat absorbing section of the heat-transfer element is connected to at least one heat-producing unit. 
     
     
         4 . The adaptive heat dissipating device as claimed in  claim 3 , wherein a heat conducting medium is applied between the heat absorbing section and the heat-producing unit. 
     
     
         5 . The adaptive heat dissipating device as claimed in  claim 1 , wherein a heat conducting medium is applied between the spherical body and the semispherical socket. 
     
     
         6 . The adaptive heat dissipating device as claimed in  claim 4 , wherein the heat conducting medium is selected from the group consisting of a solder paste and a thermal paste. 
     
     
         7 . The adaptive heat dissipating device as claimed in  claim 5 , wherein the heat conducting medium is selected from the group consisting of a solder paste and a thermal paste. 
     
     
         8 . The adaptive heat dissipating device as claimed in  claim 3 , wherein the heat-producing unit is an LED module. 
     
     
         9 . The adaptive heat dissipating device as claimed in  claim 4 , wherein the heat-producing unit is an LED module. 
     
     
         10 . The adaptive heat dissipating device as claimed in  claim 1 , wherein the first connecting section is a heat pipe. 
     
     
         11 . The adaptive heat dissipating device as claimed in  claim 1 , wherein the second connecting section is a heat pipe.