Flexible substrate structure and method of fabricating the same

Abstract

A flexible substrate structure includes a supporting carrier, a flexible substrate, and a release layer. The flexible substrate is disposed on the supporting carrier. The release layer is disposed between and in contact with the supporting carrier and the flexible substrate. The release layer includes a bonding region with adhesion property, the bonding region is for bonding the flexible substrate and the supporting carrier together, and a release region without adhesion property, the release region is for supporting the flexible substrate.

1 . A flexible substrate structure, comprising:
 a supporting carrier;   a flexible substrate, disposed on the supporting carrier; and   a release layer, disposed between the supporting carrier and the flexible substrate, and in contact with the supporting carrier and the flexible substrate respectively, wherein the release layer comprises a bonding region with adhesion property, the bonding region is for bonding the flexible substrate and the supporting carrier together, and a release region without adhesion property, the release region is for supporting the flexible substrate.   
     
     
         2 . The flexible substrate structure according to  claim 1 , wherein the release layer comprises a photo-sensitive adhesive layer, the photo-sensitive adhesive layer is able to obtain adhesion property after being illuminated by a light source. 
     
     
         3 . The flexible substrate structure according to  claim 2 , wherein a material of the release layer includes parylene or cyclic olefin copolymers (COC). 
     
     
         4 . The flexible substrate structure according to  claim 1 , wherein the supporting carrier comprises a glass carrier, a semiconductor carrier or a metal carrier. 
     
     
         5 . The flexible substrate structure according to  claim 1 , wherein a material of the flexible substrate includes polyimide (PI), polycarbonate (PC), polyethersulfone (PES), polyacrylate (PA), polynorbornene (PNB), polyethylene terephthalate (PET), polyetheretherketone (PEEK), polyethylene naphthalate (PEN) or polyetherimide (PEI). 
     
     
         6 . The flexible substrate structure according to  claim 1 , wherein the flexible substrate is not in contact with the supporting carrier. 
     
     
         7 . The flexible substrate structure according to  claim 1 , wherein the release layer completely covers the flexible substrate. 
     
     
         8 . The flexible substrate structure according to  claim 1 , wherein the flexible substrate comprises a central region and a peripheral region surrounding the central region, the bonding region with adhesion property of the release layer corresponds to the peripheral region of the flexible substrate, and the release region without adhesion property of the release layer corresponds to the central region of the flexible substrate. 
     
     
         9 . The flexible substrate structure according to  claim 8 , wherein the release layer within the release region remains on the supporting carrier after the central region of the flexible substrate is separated from the release layer. 
     
     
         10 . A method of fabricating a flexible substrate structure, comprising:
 providing a supporting carrier;   forming a release layer on the supporting carrier; and   performing a local modification process to form a bonding region with adhesion property in modified parts of the release layer, and to form a release region without adhesion property in unmodified parts of the release layer.   
     
     
         11 . The method of fabricating the flexible substrate structure according to  claim 10 , further comprising forming a flexible substrate on the release layer, wherein the release layer is in contact with the supporting carrier and the flexible substrate respectively, and the supporting carrier and the flexible substrate are bonded together by the bonding region of the release layer. 
     
     
         12 . The method of fabricating the flexible substrate structure according to  claim 11 , wherein the local modification process is performed before the flexible substrate is formed. 
     
     
         13 . The method of fabricating the flexible substrate structure according to  claim 11 , wherein the local modification process is performed after the flexible substrate is formed. 
     
     
         14 . The method of fabricating the flexible substrate structure according to  claim 11 , wherein the release layer completely covers the flexible substrate. 
     
     
         15 . The method of fabricating the flexible substrate structure according to  claim 10 , wherein the release layer comprises a photo-sensitive adhesive layer, and the local modification process comprises performing a local exposure process with a light source to form the bonding region with adhesion property in illuminated parts of the release layer, and to form a release region without adhesion property in unilluminated parts of the release layer. 
     
     
         16 . The method of fabricating the flexible substrate structure according to  claim 15 , wherein an exposure time of the local modification process is substantially between 40 seconds and 120 seconds. 
     
     
         17 . The method of fabricating the flexible substrate structure according to  claim 15 , wherein the light source includes an ultraviolet light source. 
     
     
         18 . The method of fabricating the flexible substrate structure according to  claim 17 , wherein a wavelength of the ultraviolet light source is substantially between 1 nanometer and 400 nanometers. 
     
     
         19 . The method of fabricating the flexible substrate structure according to  claim 15 , wherein the light source includes a laser light source. 
     
     
         20 . The method of fabricating the flexible substrate structure according to  claim 10 , wherein the release layer comprises a thermal-sensitive adhesive layer, the local modification process comprises performing a local heating process to form the bonding region with adhesion property in heated parts of the release layer, and to form a release region without adhesion property in unheated parts of the release layer. 
     
     
         21 . The method of fabricating the flexible substrate structure according to  claim 20 , wherein the local heating process is performed under an aerobic environment, and a temperature of the local heating process is substantially higher than 200° C. 
     
     
         22 . The method of fabricating the flexible substrate structure according to  claim 10 , wherein a power substantially between 76 Kcal/mol and 140 Kcal/mol is required in the local modification process. 
     
     
         23 . The method of fabricating the flexible substrate structure according to  claim 10 , wherein a material of the release layer includes parylene or cyclic olefin copolymers (COC). 
     
     
         24 . The method of fabricating the flexible substrate structure according to  claim 10 , wherein the supporting carrier comprises a glass carrier, a semiconductor carrier or a metal carrier. 
     
     
         25 . The method of fabricating the flexible substrate structure according to  claim 10 , wherein a material of the flexible substrate includes polyimide (PI), polycarbonate (PC), polyethersulfone (PES), polyacrylate (PA), polynorbornene (PNB), polyethylene terephthalate (PET), polyetheretherketone (PEEK), polyethylene naphthalate (PEN) or polyetherimide (PEI). 
     
     
         26 . The method of fabricating the flexible substrate structure according to  claim 10 , wherein the flexible substrate comprises a central region and a peripheral region surrounding the central region, wherein the bonding region with adhesion property of the release layer corresponds to the peripheral region of the flexible substrate, and a release region without adhesion property of the release layer corresponds to the central region of the flexible substrate. 
     
     
         27 . The method of fabricating the flexible substrate structure according to  claim 26 , further comprising cutting the flexible substrate at positions corresponding to edges around the release region of the release layer for separating the central region of the flexible substrate from the release layer and the supporting carrier. 
     
     
         28 . The method of fabricating the flexible substrate structure according to  claim 27 , wherein the release layer within the release region remains on the supporting carrier after the central region of the flexible substrate is separated from the release layer.