Integrated Semiconductor Outline Package

Abstract

A transistor outline package is provided for a semiconductor integrated device suitable for use in a control module of an automobile for connection between a printed circuit board and a bus bar of such a module. The package includes a package housing, having a first end suitable for mounting to a PCB and which has a width. The package is also formed with a leadframe which includes a heat sink and ground plane blade suitable for connection to a bus bar, a plurality of connector leads suitable for connection to a PCB and at least one source tab lead suitable for connection to a module connector of such a control module. The plurality of connection leads and the source tab lead extend from the first end of the package housing side by side in the direction along and within the width of the first end of the package housing.

1 . A control module of an automobile comprising:
 a printed circuit board (PCB);   a bus bar;   a plurality of module connectors for connecting the control module to electronic components of the automobile; and   a semiconductor package disposed between the bus bar and the PCB, the semiconductor package comprising:
 a semiconductor integrated device encapsulated in a package housing having a first end with a width, and 
 a plurality of leads, each lead having a first portion adjacent to and extending out of the package housing, wherein the first portions fit within the width of the package housing, wherein at least one of the plurality of leads is a source tab lead and at least one of the plurality of leads is a connection lead coupled to the PCB, wherein the connection leads are configured to be attached as a surface mount connection to a PCB, wherein the source tab lead passes through the PCB as a through hole connection to a module connector of the plurality of module connectors. 
   
     
     
         2 . The control module of  claim 1 , wherein the module connector has a width substantially greater than a width of any of the first portions. 
     
     
         3 . The control module of  claim 1 , wherein a heat sink blade extends from a second end of the package housing, the heat sink blade disposed between the bus bar and the package housing, the second end of the package housing being opposite to the first end of the package housing along a vertical direction. 
     
     
         4 . The control module of  claim 3 , wherein the heat sink blade comprises a first portion parallel to the package housing and a second portion parallel to the bus bar, the first portion and the second portion being orthogonal to each other, wherein the connection lead bends to one side in a horizontal direction, and wherein the source tab lead bends in the opposite horizontal direction. 
     
     
         5 . The control module of  claim 1 , wherein the source tab lead transitions into a module connector of the plurality of module connectors. 
     
     
         6 . A control module of an automobile comprising:
 a printed circuit board (PCB);   a bus bar;   a semiconductor integrated device encapsulated in a package housing having a first end with a width, the package housing disposed between the bus bar and the PCB;   a heat sink blade disposed between the bus bar and the package housing;   a plurality of leads, each lead having a first portion adjacent to and extending out of the package housing, wherein the first portions fit within the width of the package housing, wherein at least one of the plurality of leads is a source tab lead and at least one of the plurality of leads is a connection lead coupled to the PCB, wherein the connection leads are configured to be attached as a surface mount connection to a PCB; and   a plurality of module connectors for connecting the control module to electronic components of the automobile, wherein the source tab lead passes through the PCB as a through hole connection to a module connector of the plurality of module connectors.   
     
     
         7 . The control module of  claim 6 , wherein the source tab lead transitions into a module connector of the plurality of module connectors. 
     
     
         8 . The control module of  claim 6 , wherein the heat sink blade extends from a second end of the package housing. 
     
     
         9 . The control module of  claim 6 , wherein the heat sink blade comprises a first portion parallel to the package housing and a second portion parallel to the bus bar, the first portion and the second portion being orthogonal to each other. 
     
     
         10 . The control module of  claim 6 , wherein the plurality of leads comprise a first set of connection leads and a second set of connection leads, wherein the first set of connection leads bend to one side in a horizontal direction, and wherein the second set of connection leads bend in the opposite horizontal direction. 
     
     
         11 . The control module of  claim 6 , wherein the connection lead bends to one side in a horizontal direction, and wherein the source tab lead bends in the opposite horizontal direction. 
     
     
         12 . A control module of an automobile comprising:
 a printed circuit board (PCB);   a bus bar;   a semiconductor integrated device encapsulated in a package housing having a first end with a width, the package housing disposed between the bus bar and the PCB;   a heat sink blade disposed between the bus bar and the package housing, the heat sink blade extending from a second end of the package housing; and   a first connection lead and a first source tab lead extending away from the first end of the package housing along a vertical direction, the first connection lead having a first portion adjacent to the first end of the package housing, wherein the first connection lead is a surface mount connection to the PCB,   wherein the first source tab lead has a neck portion adjacent to the first end of the package housing, and wherein a portion of the source tab lead is a connection to a module connector through a through hole in the PCB.   
     
     
         13 . The control module of  claim 12 , wherein the neck portion of the first source tab lead has a width less than the width of the first end providing space for the first portion of the connection lead, and wherein the neck portion overlaps within the width of the first end of the package housing. 
     
     
         14 . The control module of  claim 12 , wherein the neck portion of the first source tab lead transitions into a module connector, wherein the module connector has a width greater than the width of the neck portion of the first source tab. 
     
     
         15 . The control module of  claim 14 , wherein a second portion has a width substantially greater than the width of the neck portion. 
     
     
         16 . The control module of  claim 12 , further comprising a second source tab lead, the first and the second source tab leads located on opposite sides of the first connection lead. 
     
     
         17 . The control module of  claim 12 , wherein the first portion of the first connection lead and the neck portion of the first source tab lead extend side by side, wherein a second connection lead extends away from the first end of the package housing along the vertical direction, and wherein the first connection lead bends to one side in a horizontal direction the second connection lead bends in the opposite horizontal direction. 
     
     
         18 . The control module of  claim 12 , wherein the first portion and the neck portion extend side by side and the first connection lead bends to one side in a horizontal direction and the source tab lead bends in an opposite horizontal direction. 
     
     
         19 . The control module of  claim 12 , wherein the heat sink blade extends along a surface of a bus bar. 
     
     
         20 . The control module of  claim 12 , wherein the package housing has a substantially uniform width from the first end to the second end.