Electronic Apparatus Cooling Device With Integrated Pump And Heat Receiving Part

Abstract

An electronic apparatus cooling device which cools an exothermic body by heat transfer of refrigerant, includes a heat receiving part having a base for receiving heat generated by the exothermic body, a pressure member with an opening, covering part of the base and being located opposite to the exothermic body, and a flow channel allowing the refrigerant to flow therein, a heat radiator for radiating heat absorbed by the refrigerant, and a pump for circulating the refrigerant between the heat receiving part and the heat radiator. In the flow channel of the heat receiving part, the refrigerant flows in through the opening of the pressure member and flows out from the periphery of the pressure member in places other than the opening.

1 . An electronic apparatus cooling device which cools an exothermic body by heat transfer of refrigerant, comprising:
 a heat receiving part which transfers heat generated by the exothermic body to the refrigerant including:
 a base for receiving heat generated by the exothermic body; and 
 fins for transferring the heat generated by the exothermic body received by the base to the refrigerant; 
   a heat radiator for radiating heat absorbed by the refrigerant; and   a vortex pump formed as one body with the heat receiving part including:
 a suction port for sucking the refrigerant from the heat radiator; 
 a discharge port for discharging the refrigerant to the heat radiator; and 
 two partitions for delimiting a pump chamber between the suction 
 port and the discharge port; 
   wherein the refrigerant, which is sucked from the suction port to the vortex pump, flows from an outflow port of the pump chamber provided between the suction port and one of the partitions to the fins, and the refrigerant, which is passed among the fins, flows from an inflow port of the pump chamber provided between the one of the partitions and the discharge port to the pump chamber.   
     
     
         2 . (canceled) 
     
     
         3 . (canceled) 
     
     
         4 . (canceled) 
     
     
         5 . (canceled) 
     
     
         6 . The electronic apparatus cooling device according to  claim 1 ,
 wherein the heat receiving part includes a plane pressure member, located at a top of the fins opposite to the base, with an opening at the center; and   wherein the refrigerant flows from the outflow port of the pump chamber to the opening of the pressure member, flows from the top of the fins to spaces among the fins, and flows along the fins from the center to a side.   
     
     
         7 . The electronic apparatus cooling device according to  claim 6 , wherein the vortex pump is magnetized, and includes a coil and a driver board inside an impeller thereof and located at upper side of the heat receiving part; and
 wherein the pressure member is located between the fins of the heat receiving part and the vortex pump.