Heat dissipation device and method for manufacturing same

Abstract

An exemplary heat dissipation device includes a base plate and heat pipes. The base plate defines recesses at one side surface and locating holes communicating with the recesses. The heat pipes each include an evaporating section received in a corresponding recess and a condensing section extending from the evaporating section. The evaporating section includes a bulge protruding outward from an outer surface thereof. The evaporating sections of the heat pipes are interference fitted in the recesses with the bulges protruding into the locating holes.

1 . A heat dissipation device, comprising:
 a base plate defining at least one recess at one side surface thereof and at least one locating hole communicated with the at least one recess; and   at least one heat pipe comprising an evaporating section received in the at least one recess and a condensing section extending from the evaporating section, the evaporating section comprising a bulge protruding outward from an outer surface thereof;   wherein the evaporating section of the at least one heat pipe is interference fitted in the at least one recess with the bulge protruding into the at least one locating hole.   
     
     
         2 . The heat dissipation device of  claim 1 , wherein the at least one locating hole is defined at another side surface of the base plate which is opposite to the side surface having the at least one recess. 
     
     
         3 . The heat dissipation device of  claim 1 , wherein two protuberances protrude outward from the outer surface of the evaporating section of the at least one heat pipe in substantially the same direction as the bulge protrudes, and the protuberances abut two opposite sides of the base plate to limit relative movement between the at least one heat pipe and the base plate. 
     
     
         4 . The heat dissipation device of  claim 1 , wherein the evaporating section comprises a bottom surface coplanar with the one side surface of the base plate, a top surface wider than the bottom surface, and two side surfaces connected between two opposite sides of the top and bottom surfaces. 
     
     
         5 . The heat dissipation device of  claim 4 , wherein the evaporating section has a substantially isosceles trapezoid cross-section. 
     
     
         6 . The heat dissipation device of  claim 4 , wherein the bulge is formed on the top surface of the evaporating section. 
     
     
         7 . The heat dissipation device of  claim 1 , further comprising a fin unit, wherein the fin unit comprises a plurality of fins each defining a through hole, and the condensing section of the at least one heat pipe is interference fitted in the through holes of the fins. 
     
     
         8 . The heat dissipation device of  claim 7 , further comprising a supporting frame between the fin unit and the base plate, the supporting frame comprising a mounting plate connected to the base plate, a plurality of connecting plates extending obliquely from the mounting plate, and a plurality of supporting plates extending outward from the connecting plates, respectively, the supporting plates contacting a bottommost fin of the fin unit. 
     
     
         9 . The heat dissipation device of  claim 8 , wherein a plurality of elastic arms extend upward and obliquely from the supporting plates, each of the elastic arms having one end extending from a corresponding supporting plate and another end spaced apart from the corresponding supporting plate, the elastic arms elastically contacting a bottommost fin of the fin unit. 
     
     
         10 . The heat dissipation device of  claim 8 , wherein the at least one heat pipe further comprises another condensing section, the condensing sections extending from two opposite ends of the evaporating section of the at least one heat pipe, respectively, the supporting plates defining perforations, and the condensing sections of the at least one heat pipe extending through the perforations. 
     
     
         11 . A method for manufacturing a heat dissipation device, the method comprising:
 providing a base plate defining at least one recess at one side surface thereof and at least one locating hole communicated with the at least one recess;   providing at least one heat pipe comprising an evaporating section and a condensing section extending from the evaporating section, the evaporating section having a round cross-section, a diameter of the evaporating section larger than a depth of the at least one recess;   mounting the at least one heat pipe to the base plate with the evaporating section received in the at least one recess, a portion of the evaporating section protruding from the at least one recess; and   punching the at least one heat pipe to force the evaporating section to deform and interferingly fit in the at least one recess, wherein a portion of an outer surface of the evaporating section forms a bulge protruded into the at least one locating hole, to thus connect the at least one heat pipe and the base plate together.   
     
     
         12 . The method of  claim 11 , wherein the at least one recess has a substantially isosceles trapezoid cross-section. 
     
     
         13 . The method of  claim 11 , wherein the at least one recess is surrounded by a top wall and two sidewalls extending obliquely from two opposite sides of the top wall, a width of the at least one recess decreasing from the top wall. 
     
     
         14 . The method of  claim 13 , wherein after punching the at least one heat pipe, a portion of the outer surface of the evaporating section forms a bottom surface coplanar with the one side surface of the base plate, a portion of outer surface of the evaporating section forms a top surface abutting the top wall, and the other portion of the outer surface of the evaporating section forms two side surfaces abutting the sidewalls, respectively. 
     
     
         15 . The method of  claim 14 , wherein the bulge is formed on the top surface. 
     
     
         16 . The method of  claim 11 , wherein after punching the at least one heat pipe, a portion of the outer surface, which is adjacent to two opposite ends of the at least one recess, of evaporating section forms two protuberances protruding in substantially the same direction as the bulge protrudes, and the protuberances abutting two opposite sides of the base plate to limit relative movement between the at least one heat pipe and the base plate. 
     
     
         17 . The method of  claim 11 , wherein the at least one locating hole is defined at another side surface of the base plate which is opposite to the side surface having the at least one recess. 
     
     
         18 . The method of  claim 11 , further comprising providing a supporting frame which comprises a mounting plate connected to the base plate, a plurality of connecting plates extending obliquely from the mounting plate, and a plurality of supporting plates extending outward from the connecting plates, respectively, the supporting plates defining perforation for the condensing section of the at least one heat pipe extending therethrough. 
     
     
         19 . The method of  claim 18 , further comprising providing a fin unit which comprises a plurality of fins, each of the fins defining at least one through hole, and the condensing section of the at least one heat pipe being interference fitted in therein. 
     
     
         20 . The method of  claim 19 , wherein a plurality of elastic arms extend upward and obliquely from the supporting plates, each of the elastic arms having one end extending from a corresponding supporting plate and another end spaced apart from the corresponding supporting plate, the elastic arms elastically contacting a bottommost fin of the fin unit.