Solar cell module

Abstract

A solar cell module is provided that comprises: a solar cell; a connection electrode provided on each of a light-receiving surface and back surface of the solar cell; a conductive resin adhesive arranged on an upper surface of the connection electrode; and a wiring material electrically connected to the solar cell and connected with the connection electrode and the conductive resin adhesive, wherein the conductive resin adhesive changes color upon curing, and the conductive resin adhesive on the upper surface of the connection electrode provided on the light-receiving surface of the solar cell is arranged within a region corresponding to at least one of the connection electrode and the wiring material, on a projection plane parallel with the light-receiving surface and exposed on a light-receiving surface side.

1 - 10 . (canceled) 
     
     
         11 . A method of manufacturing a solar cell module, comprising:
 preparing a solar cell comprising a light-receiving surface and back surface;   forming connection electrodes on at least the light-receiving surface or back surface of the solar cell, the connection electrodes having an electrode conductive adhesive contact surface;   coating conductive resin adhesive on at least some of the electrode conductive adhesive contact surface of the connection electrodes; and   contacting wiring material to the connection electrodes via a wiring material conductive adhesive contact surface of the wiring material to make electrical contact;   wherein the width of resin adhesive contact on the electrode conductive adhesive contact surface differs from the width of the resin adhesive contact on the wiring material conductive adhesive contact surface.   
     
     
         12 . The method of  claim 11 , wherein the width of resin adhesive contact on the electrode is greater than the width of the electrode conductive adhesive contact surface and the width of resin adhesive contact on the wiring material is greater than the width of the wiring material conductive adhesive contact surface. 
     
     
         13 . The method of  claim 12 , wherein the conductive resin adhesive covers only the side edges of the connection electrodes. 
     
     
         14 . The method of  claim 11 , wherein the wiring material has openings that expose the conductive resin adhesive. 
     
     
         15 . The method of  claim 11 , wherein the wiring material has one or more notches that expose the conductive resin adhesive. 
     
     
         16 . The method of  claim 14 , wherein the conductive resin adhesive completely 
     
     
         17 . The method of  claim 16 , wherein the conductive resin adhesive covers only part of the connection electrode. 
     
     
         18 . The method of  claim 17 , wherein the conductive resin adhesive protrudes from the wiring material within a surface on the wiring material side of the connection electrode. 
     
     
         19 . The method of  claim 11 , wherein the wiring material contacts the connection electrodes. 
     
     
         20 . A method of manufacturing a solar cell module, comprising:
 preparing a solar cell comprising a light-receiving surface and back surface;   forming connection electrodes on at least the light-receiving surface or back surface of the solar cell;   applying conductive resin adhesive to the connection electrodes, wherein the conductive resin adhesive covers a greater width than the surfaces of the connection electrodes; and   bonding a wiring material to a surface of the connection electrodes that has applied conductive resin adhesive so that the wiring materials are electrically connected to the connection electrodes.   
     
     
         21 . The method of  claim 20 , wherein the width of the applied conductive resin adhesive is greater than the width of the wiring material. 
     
     
         22 . The method of  claim 21 , wherein the conductive resin adhesive covers only the side edges of the connection electrodes. 
     
     
         23 . The method of  claim 20  wherein the wiring material has openings that expose the conductive resin adhesive. 
     
     
         24 . The method of  claim 20 , wherein the wiring material has one or more notches that expose the conductive resin adhesive. 
     
     
         25 . The method of  claim 23 , wherein the conductive resin adhesive completely fills the openings within the wiring material 
     
     
         26 . The method of  claim 25 , wherein the conductive resin adhesive covers only part of the connection electrode. 
     
     
         27 . The method of  claim 21 , wherein the conductive resin adhesive protrudes from the wiring material within a surface on the wiring material side of the connection electrode. 
     
     
         28 . The method of  claim 20 , the wiring material contacts the connection electrodes.