Submount, optical module provided therewith, and submount manufacturing method

Abstract

In order to simplify submount manufacture, and increase the manufacturing efficiency thereof, a first electrode layer ( 12 ) is formed as a layer on the surface of a submount substrate ( 11 ); a side surface ( 122 ) of the first electrode layer ( 12 ) is formed on substantially the same plane as a side surface ( 112 ) of the submount substrate ( 11 ); and the side surface ( 122 ) of the first electrode layer ( 12 ) is a connection surface for creating an electrical connection with the first electrode layer ( 12 ). By making the first electrode layer ( 12 ) sufficiently thick, the surface area of the side surface ( 122 ) can be made sufficiently large. This allows, for example, wire bonding using this side surface ( 122 ). Further, components such as an optical element ( 14 ) can be protected by a sealing material ( 16 ).

1 . A submount, comprising a submount substrate, a first electrode layer, an optical element, and a sealing member,
 the submount substrate comprising a surface, and a side surface adjacent to this surface,   the first electrode layer being formed by laminating on the surface of the submount substrate,   a side surface of the first electrode layer being formed straddling from the surface of the submount substrate to the surface of the first electrode layer,   the side surface of the first electrode layer being formed on substantially the same plane as the side surface of the submount substrate,   the side surface and the surface of the first electrode layer constituting contact surfaces for electrically connecting to this first electrode layer,   the surface of the first electrode layer and the optical element being electrically connected,   the sealing member covering the surface of the first electrode layer and the surface of the optical element,   and the sealing member exposing a side surface of the first electrode layer.   
     
     
         2 . The submount of  claim 1 , further comprising a second electrode layer,
 the second electrode layer being formed on the surface of the submount substrate,   and the optical element being mounted on the second electrode layer.   
     
     
         3 . The submount of  claim 2 , wherein the submount substrate is provided with a via and a heat dissipator,
 the heat dissipator being arranged on a rear surface side of the submount substrate in a state exposed to the outside,   and the via thermally connecting the second electrode layer and the heat dissipator.   
     
     
         4 . The submount disclosed in  claim 1 , wherein the side surface of the first electrode layer is connected to one end of a bonding wire. 
     
     
         5 . The submount disclosed in  claim 1 , wherein the side surface of the first electrode layer is connected to an electrode of a module substrate. 
     
     
         6 . The submount disclosed in  claim 2 , wherein a drive element for driving the optical elements, or an amplifying element for amplifying output from the optical element, is mounted on the second electrode layer. 
     
     
         7 . The submount disclosed in  claim 1 , further comprising a second electrode layer,
 the second electrode layer being formed on the surface of the submount substrate,   and a silicon photonics IC being mounted on the second electrode layer.   
     
     
         8 . The submount disclosed in  claim 2 , wherein the sealing member also exposes a side surface of the second electrode layer. 
     
     
         9 . An optical module provided with the submount of  claim 1 , and a module substrate upon which the submount is mounted. 
     
     
         10 . A manufacturing method for a submount, comprising the following steps:
 (1) a step of laminating a first conductive layer on a surface of a submount substrate;   (2) a step of forming the first conductive layer in a predetermined shape using a mask pattern;   (3) a step of sealing a surface of the first conductive layer and a surface of an optical element using a sealing member; and   (4) a step of forming a side surface, that is formed on substantially the same plane as the side surface of the submount substrate and has been exposed to the outside, on the first conductive layer, by cutting the first conductive layer in the thickness direction together with the submount substrate.   
     
     
         11 . A manufacturing method for a submount, comprising the following steps:
 (1) a step of laminating a first conductive layer on a surface of a submount substrate;   (2) a step of forming the first conductive layer in a predetermined shape by machining;   (3) a step of sealing a surface of the first conductive layer and a surface of an optical element using a sealing member; and   (4) a step of forming a side surface, that is formed on substantially the same plane as the side surface of the submount substrate and has been exposed to the outside, on the first conductive layer, by cutting the first conductive layer in the thickness direction together with the submount substrate.   
     
     
         12 . A manufacturing method for the submount disclosed in  claim 10 , further comprising the following step:
 (5) after step (4), forming a thin film on the side surface of the first electrode layer in order to carry out electrical connection from the outside to this first electrode layer.   
     
     
         13 . A manufacturing method for the submount disclosed in  claim 11 , further comprising the following step:
 (5) after step (4), forming a thin film on the side surface of the first electrode layer in order to carry out electrical connection from the outside to this first electrode layer.   
     
     
         14 . The submount disclosed in  claim 7 , wherein the sealing member also exposes a side surface of the second electrode layer.