Heat dissipation device and method of manufacturing same
Abstract
An exemplary heat dissipation device includes a first fin unit, a second fin unit, a heat pipe, a first base and a second base. The heat pipe includes a condensing section extended through the first fin unit and the second fin unit and an evaporating section extending from the condensing section. The evaporating section includes a first heat absorbing portion extended through the first fin unit and a second heat absorbing portion spaced from the second fin unit. The first base is located at one side of the second fin unit and supports the second heat absorbing portion thereon. The second base is covered on the first base. The first and second bases sandwich the second heat absorbing portion therebetween.
Claims
exact text as granted — not AI-modified1 . A heat dissipation device, comprising:
a first fin unit comprising a plurality of first fins stacked together; a second fin unit located at one side of the first fin unit and comprising a plurality of second fins stacked together; a heat pipe comprising a condensing section extended through the first fin unit and the second fin unit and an evaporating section extending from the condensing section, the evaporating section comprising a first heat absorbing portion extended through the first fin unit and a second heat absorbing portion spaced from the second fin unit; a first base located at one side of the second fin unit and supporting the second heat absorbing portion thereon; and a second base covering the first base, the first and second bases clamping the second heat absorbing portion therebetween.
2 . The heat dissipation device of claim 1 , wherein the first base and the second base cooperatively defines a through hole for interference receiving the second heat absorbing portion therein.
3 . The heat dissipation device of claim 2 , wherein the first base comprises a first receiving groove for receiving a part of the second heat absorbing portion therein, and the second base comprises a second receiving groove for receiving another part of the second heat absorbing portion therein.
4 . The heat dissipation device of claim 2 , wherein the second heat absorbing portion has an ellipse transverse cross-section.
5 . The heat dissipation device of claim 1 , wherein the second fin unit defines a receiving a receiving room at a top side thereof, the first base being received in the receiving room.
6 . The heat dissipation device of claim 5 , wherein the first fin unit defines a first through hole for the condensing section of the heat pipe interference fitted therein and a second through hole higher than the receiving room, the first heat absorbing portion interference fitted in the second through hole of the first fin unit.
7 . The heat dissipation device of claim 6 , further comprising a third fin unit located at one side of the second fin unit which is away from the first fin unit, the third fin unit defining a first through hole for condensing section of the heat pipe interference fitted therein and a second through hole higher than the receiving room, wherein the evaporating section of the heat pipe further comprises a third absorbing portion extending from the second absorbing portion and interference fitted in the second through hole of the third fin unit.
8 . The heat dissipation device of claim 1 , wherein the condensing section is parallel to the evaporating section, the heat pipe further comprising a connecting section connected between the condensing section and the evaporating section.
9 . The heat dissipation device of claim 1 , wherein each of the first fins comprises a main body, an extending portion extending upward from a middle portion of a top side of the main body, a first flange extending perpendicularly from a bottom side of the main body and a second flange extending perpendicularly from other portion of the top side of the main body except where the extending portion is formed.
10 . The heat dissipation device of claim 9 , wherein each of the second fins comprises a main body, a pair of ears extending upward from two opposite ends of a top side of the main body, respectively, a first flange extending perpendicularly from a bottom side of the main body and a pair of second flanges extending perpendicularly from top sides of the ears, respectively.
11 . A method of manufacturing a heat dissipation device, the method comprising:
providing a heat pipe comprising an evaporating section and a condensing section, the evaporating section comprising a first heat absorbing portion and a second heat absorbing portion, the second heat absorbing portion having a circular transverse cross section; providing a first fin unit comprising a plurality of first fins stacked together and cooperatively defining a first through hole and a second through hole therein, the heat pipe connected to the first fin unit with the condensing section interference fitted in the first through hole and the first absorbing portion interference fitted in the second through hole; providing a second fin unit comprising a plurality of second fins stacked together and cooperatively defining a first through hole for the condensing section of the heat pipe to be interference fitted therein; providing a first base, mounting the first base on one side of the second fin unit, and supporting the second heat absorbing portion on the first base, with the second absorbing portion of the heat pipe being located above the second fin unit; providing a second base, and covering the second base over the first base to sandwich the second heat absorbing portion between the first base and the second base; and connecting the first and second bases together with a plurality of fasteners, such that the second heat absorbing portion is deformed and clamped between the first base and the second base.
12 . The method of claim 11 , wherein the second heat absorbing portion has an ellipse transverse cross section after deformed.
13 . The method of claim 11 , wherein the first base and the second base cooperatively defines a through hole for interference receiving the second heat absorbing portion therein.
14 . The method of claim 13 , wherein the first base comprises a first receiving groove for receiving a part of the second heat absorbing portion therein, the second base comprises a second receiving groove for receiving another part of the second heat absorbing portion therein, and a sum of depths of the first receiving groove and the second receiving groove is smaller than an outer diameter of the second heat absorbing portion before the second heat absorbing portion is deformed.
15 . The method of claim 11 , wherein the second fin unit defines a receiving a receiving room at a top side thereof, the first base being received in the receiving room.
16 . The method of claim 15 , wherein the second through hole is higher than the receiving room.
17 . The method of claim 16 , further comprising: providing a third fin unit, the third fin unit defining a first through hole and a second through hole higher than the receiving room, wherein the evaporating section of the heat pipe further comprises a third absorbing portion extending from the second absorbing portion; positioning the third fin unit at one side of the second fin unit which is away from the first fin unit; interference fitting the condensing section of the heat pipe in the first through hole of the third fin unit; and interference fitting the third absorbing portion of the heat pipe in the second through hole of the third fin unit.
18 . The method of claim 11 , wherein the condensing section is parallel to the evaporating section, the heat pipe further comprising a connecting section connected between the condensing section and the evaporating section.
19 . The method of claim 18 , wherein the heat pipe is U-shaped.
20 . The method of claim 11 , wherein a plurality of mounting holes are defined in the first base, and a plurality of locating holes are defined in the second base, the fasteners respectively extended through the locating holes and further screwed into the mounting holes for connecting the first base and the second base together.Join the waitlist — get patent alerts
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