US2012145551A1PendingUtilityA1
Electroplated Magnetic Film for Read-Write Applications
Est. expiryMay 10, 2026(expired)· nominal 20-yr term from priority
H01F 41/26C25D 5/18C25D 3/562G11B 5/3163
50
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0
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Claims
Abstract
A process is described for the fabrication, through electrodeposition, of Fe x Co y Ni z (x=60-71, y=25-35, z=0-5) films that have, in their as-deposited form, a saturation magnetization of at least 24 kG and a coercivity of less than 0.3 Oe. A key feature is the addition of aryl sulfinates to the plating bath along with a suitable seed layer.
Claims
exact text as granted — not AI-modified1 . A process for the formation of a magnetic write head that is fully integrated with a magnetic read head that includes a TMJ, comprising:
forming said read head, including an upper magnetic shield layer; electrodepositing over said upper magnetic shield a first layer of magnetic material having, as deposited, a saturation magnetization of at least 24kG and a coercivity less than 0.3 Oe; forming a magnetizing coil over said first layer; electrodepositing over said first layer a second layer of magnetic material having, as deposited, a saturation magnetization of at least 24 kG and a coercivity less than 0.3 Oe, said first and second layers being magnetically connected at a first end and magnetically separated at a second, opposing, end; and forming an additional magnetic shield layer over said second layer, thereby completing formation of said magnetic write head without ever subjecting said TMJ read head to a heat treatment.
2 . The process recited in claim 1 wherein the steps of electrodepositing said first and second magnetic layers further comprise:
providing a plating bath comprising:
NiSO 4 •6H 2 O
0-70
g/L
FeSO 4 •7H 2 O
25-120
g/L
CoSO 4 •6H 2 O
10-60
g/L
H 3 BO 3
20-30
g/L
NaCl
0.5-30
g/L
surfactant
0-0.15
g/L, and
Aryl sulfinates
0.05-0.3
g/L;
adjusting said plating bath to have a pH in the range of about 2 to 3;
providing an anode selected from the group consisting of Ni and Co; and
depositing said layers from said plating bath through the application of asymmetric A.C. under conditions that further comprise:
a Forward Peak Current Density between about 5 and 30 mA/cm 2 ,
a Reverse Peak current density of up to about 10 mA/cm 2 ,
a Forward ON time in the range of from about 5 to 100 ms,
a Reverse ON time of up to about 30 ms, and
a bath temperature in the range of about 10 to 25% C.
3 . The process recited in claim 1 wherein said first and second magnetic layers are deposited on a seed layer of ruthenium.
4 . The process recited in claim 1 wherein each of said layers of magnetic material has high corrosion resistance, as characterized by a corrosion potential of about −0.18V and an anodic current density of about 10 -5 A/cm 2 at −0.05 volts, in a solution of sodium chloride
5 . The process recited in claim 1 wherein each of said layers of magnetic material has an internal stress no greater than about 250 MPa.Join the waitlist — get patent alerts
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