US2012145375A1PendingUtilityA1
Thermal Impedance Matching Using Common Materials
Individually held — no corporate assignee on recordPriority: Jan 26, 2010Filed: Feb 2, 2012Published: Jun 14, 2012
Est. expiryJan 26, 2030(~3.5 yrs left)· nominal 20-yr term from priority
Inventors:Denny D. Beasley
F21V 29/85F21Y 2105/10C07C 209/02F21Y 2115/10C07F 7/003F21V 29/70
42
PatentIndex Score
0
Cited by
0
References
0
Claims
Abstract
A device and method for dissipating heat from a source of heat is described. A plurality of layers of thermally conductive materials receives a flow of heat from a source of heat. A first layer of the plurality of layers receives the flow of heat from the source of heat and redirects and transfers the flow of heat to a second of the plurality of layers. Each layer has a separate preselected thermal impedance to control a desired temperature change across the plurality of layers and to maintain a desired operating temperature of the source heat.
Claims
exact text as granted — not AI-modified1 . A method of managing heat from a source of heat comprising the steps of:
providing a first layer of a material having a first preselected thermal impedance; providing a second layer of a material having a second preselected thermal impedance; transferring a flow of heat from the source of heat to the first layer; altering a direction of the flow of heat through the first and second layers using a difference between the first preselected thermal impedance and the second preselected thermal impedance to create a temperature change from the first layer to the second layer; and altering a ratio of a volume of the first layer to a volume of the second layer to control a desired temperature change from the first layer to the second layer.
2 . The method of claim 1 further comprising the steps of:
providing a third layer of a material having a third preselected thermal impedance; and
transferring a flow of heat through the first, second and third layers wherein a direction of the flow of heat is altered in each subsequent layer.
3 . The method of claim 2 wherein magnitudes of the preselected thermal impedances of the first, second, and third layers ascend in value from the first layer to the third layer.
4 . The method of claim 2 wherein each of the first, second and third layers has a volume and wherein the third layer volume is greater than the second layer volume and the second layer volume is greater than the first layer volume.
5 . The method of claim 2 wherein magnitudes of the preselected thermal impedances of the first, second, and third layers descend in value from the first layer to the third layer.
6 . The method of claim 2 further comprising the steps of:
providing a fourth layer of a material having a fourth preselected thermal impedance; and
transferring a flow of heat through the first, second, and fourth layers wherein the direction of the flow of heat is altered in each subsequent layer.
7 . The method of claim 6 further comprising the steps of:
placing the fourth layer in communication with an environmental object of a material having fifth thermal impedance; and
transferring a flow of heat through the first, second, third layers, and fourth layers to the fifth layer wherein the direction of the flow of heat is altered in each subsequent layer.
8 . The method of claim 7 wherein the fifth layer is an environmental object produced from a material selected from the group consisting of: a polymeric material; a cellulose material, a ceramic, a glass, a metallic material.
9 . The method of claim 1 further comprising the step of:
selecting values of the first and second impedances to allow for an inherent re-vectoring of heat flow into a region of lower thermal density as a response to an external uncontrolled environment to preserve a desired temperature change through the layers.
10 . The method of claim 9 wherein the external uncontrolled environment is a build-up of dust on one or more of the layers.
11 . A method of dissipating heat from a source of heat comprising:
providing a source of heat; providing a first layer of a first material having a first thermal conductivity adjacent the source of heat; providing a second layer of a second material having a second thermal conductivity adjacent the first layer; and selecting volumetric dimensions of the first and second layers to match a thermal impedance of the first layer to a thermal impedance of the second layer and to minimize a change in temperature from the first layer to the second layer.
12 . The method of claim 11 wherein a desired temperature change from the first layer to the second layer zero degrees.
13 . The method of claim 11 further comprising the step of:
establishing an average temperature of the first and second layers wherein the average temperature of the first and second layers is nearly uniform over the volume of the first and second layers.
14 . The method of claim 11 further comprising the step of:
selecting volumetric dimensions of the first and second layers to match a thermal impedance of the first layer to a thermal impedance of the second layer to control a desired change in temperature from the first layer to the second layer according to the equation:
W
1
*
L
1
A
1
K
°
1
=
W
2
*
L
2
A
2
K
°
2
wherein W 1 is a load on the first layer expressed in watts, W 2 is a load on the second layer expressed in watts, L 1 is a thickness of the first layer expressed in meters, L 2 is a thickness of the second layer expressed in meters, A 1 is a surface area of the first layer expressed in square meters, K° 1 is a desired temperature of the first layer expressed in degrees Kelvin, K° 2 is a desired temperature of the second layer expressed in degrees Kelvin, and A 2 is a surface area of the second layer expressed in square meters.
15 . The method of claim 11 wherein a desired temperature of a first layer in the plurality of layers is about equal to a desired temperature of a second layer in the plurality of layers, a load on the first layer is equal to a load on the second layer, wherein the volumetric dimensions of the first layer and the second layer are selected according to the equation:
T
C
1
T
C
2
=
L
2
/
A
2
L
1
/
A
1
wherein T C1 is the thermal conductivity of the first layer, T C2 is the thermal conductivity of the second layer, L 1 is a thickness of the first layer, L 2 is a thickness of the second layer, A 1 is a surface area of the first layer, and A 2 is a surface area of the second layer.
16 . The method of claim 11 further comprising the step of:
equalizing a thermal potential drop at the first and second layers orthogonally to a normal heat flow vector.
17 . The method of claim 11 further comprising the step of:
creating a nearly uniform heat flux density in the first and second layers.
18 . The method of claim 11 further comprising the step of:
transferring heat across the first and second layers to create an optimal thermal distribution to deliver heat flux densities that match with the materials heat flow capabilities.
19 . A method of passively dissipating heat from a source of heat comprising the steps of:
forming a plurality of successive layers of thermally conductive materials each having a thermal conductivity less than a thermal conductivity of a preceding layer wherein the plurality of successive layers comprises at least a first layer, a second layer, and a third layer in stacked relationship; and matching thermal impedances of the plurality of successive layers to achieve a desired temperature change from one layer to an adjacent layer in the plurality of successive layers by controlling a volume of one layer relative to an adjacent layer in the plurality of successive layers.
20 . The method of claim 19 further comprising the steps of:
establishing an average temperature of each layer in stacked relationship wherein the average temperature of each layer is nearly uniform over the volume of each;
equalizing a thermal potential drop at each layer orthogonally to a normal heat flow vector; and
creating a nearly uniform heat flux density in each layer in stacked relationship.Join the waitlist — get patent alerts
Track US2012145375A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.