Vacuum enveloping component for vacuum-based electronic devices and method of fabrication thereof

Abstract

The apparatus and method of the present invention provide an improved low cost and easy to manufacture vacuum-proof shatter-resistant enveloping component, having superior temperature stability, as well as high temperature and mechanical reliability, that is readily usable with any electronic/thermoelectric device that utilizes enveloped vacuum in the operation thereof. In accordance with various embodiments of the present invention, rather than being made from a single layer glass or a ceramic material, the novel vacuum enveloping component comprises a hollow housing fabricated from a thermo-stable metal alloy, and provided with an inner insulating layer composed of a non-conductive material.

1 . A method for fabricating a vacuum enveloping component for use with vacuum-based electronic and thermo-electric devices, comprising the steps of:
 (a) fabricating a hollow housing from a material comprising at least one metal of at least a predetermined desired degree of thermal and mechanical stability, said hollow housing being sized and configured to provide vacuum-enveloping functionality to a predetermined vacuum-based device, and comprising an interior surface region, and   (b) depositing an insulating material layer over at least a substantial portion of said inner surface region.