Novel phenolic resins

Abstract

The invention herein disclosed comprises the use of oxazolidines, nitroalcohols, nitrones, halonitroparaffins, oxazines, azaadamantanes, hexamethylenetetramine salts, nitroamines, imidazolidines, triazines, nitrooxazolidines, and imidazolidine-oxazolidine hybrids to serve as hardeners for curing phenolic resins. The hardeners and accelerators/catalysts described in the invention can be applied in any application were phenolic resins are used, including but not limited to fiber reinforced composite applications such as pultrusion, filament winding, bulk molding compound (BMC), sheet molding compounds (SMC), vacuum assisted resin transfer, prepregs, adhesives, foundry materials, abrasives, friction materials, insulation, laminates, coatings, electronics, fire resistant, and flame-retardant end uses.

1 - 59 . (canceled) 
     
     
         60 . A curable phenolic resin comprising:
 a. a novolac resin prepared from a phenolic compound and an aldehyde, wherein the ratio of phenolic compound to aldehyde is less than one;   b. a curing agent comprising an imidazolidine, and optionally:   c. a basic accelerator/catalyst;   d. a reactive diluent;   e. an inert solvent diluent.   
     
     
         61 . The curable phenolic resin of  claim 60 , wherein the phenolic compound is selected from the group consisting of phenol, resorcinol, bisphenol, phloroglucinol, cresols, alkyl phenols, phenol ethers, tannins and lignins. 
     
     
         62 . The curable phenolic resin of  claim 60 , wherein the aldehyde is selected from the group consisting of formaldehyde, acetaldehyde, propionaldehyde, cyclohexanedicarboxaldehydes, benzaldehydes, furfural, an aryl aldehyde and a heterocyclic aldehyde. 
     
     
         63 . The curable phenolic resin of  claim 60 , wherein the curing agent comprises an imidazolidine having the following structure: 
       
         
           
           
               
               
           
         
         wherein R 1  to R 8  may be the same or different, selected from H, C 2 -C 24  linear or branched alkyl or alkenyl, cycloalkyl, cycloalkenyl, phenyl, substituted aryl, heterocyclic, hydroxymethyl, hydroxy-terminated polyoxyalkylene, or halogen; 
       
       
         
           
           
               
               
           
         
         wherein R 1  to R 11  may be the same or different, selected from H, C 2 -C 24  linear or branched alkyl or alkenyl, cycloalkyl, cycloalkenyl, phenyl, substituted aryl, heterocyclic, hydroxymethyl, hydroxy-terminated polyoxyalkylene, or halogen; 
       
       
         
           
           
               
               
           
         
         wherein R 1  to R 17  may be the same or different, selected from H, C 2 -C 24  linear or branched alkyl or alkenyl, cycloalkyl, cycloalkenyl, phenyl, substituted aryl, heterocyclic, hydroxymethyl, hydroxy-terminated polyoxyalkylene, or halogen; 
       
       
         
           
           
               
               
           
         
         wherein R 1  to R 17  may be the same or different, selected from H, C 2 -C 24  linear or branched alkyl or alkenyl, cycloalkyl, cycloalkenyl, phenyl, substituted aryl, heterocyclic, hydroxymethyl, hydroxy-terminated polyoxyalkylene, or halogen; or 
       
       
         
           
           
               
               
           
         
         wherein n is an integer from 1 to 6, and R 1  to R 7  may be the same or different, selected from H, C 2 -C 24  linear or branched alkyl or alkenyl, cycloalkyl, cycloalkenyl, phenyl, substituted aryl, heterocyclic, hydroxymethyl, hydroxy-terminated polyoxyalkylene, or halogen. 
       
     
     
         64 . The curable phenolic resin of  claim 63  wherein the imidazolidine is selected from the group consisting of 1-imidazolidineethanol and 1,3-dipheylimidazolidine. 
     
     
         65 . The curable phenolic resin of  claim 60 , wherein the basic inorganic accelerator/catalyst is selected from the group consisting of sodium hydroxide, potassium hydroxide, lithium hydroxide, magnesium hydroxide, and calcium oxide. 
     
     
         66 . The curable phenolic resin of  claim 60 , wherein the basic organic accelerator/catalyst is selected from the group consisting of trimethylamine (TMA), triethylamine (TEA), 2-(dimethylamino)-2-(hydroxymethyl)-1,3-propanediol (DMTA), 1,1,3,3-tetramethylguanidine (TMG), tetramethylammonium hydroxide, 1,4-diazabicyclo[2.2.2]octane (Dabco™), 1,8-diazabicyclo[5.4.0]undec-7-ene (DBU), 1,5-diazabicyclo[4.3.0]non-5-ene (DBN), or metal alkoxides such as but not limited to sodium methoxide, sodium ethoxide, potassium methoxide, potassium ethoxide, potassium t-butoxide, sodium phenoxide, and potassium phenoxide. 
     
     
         67 . The curable phenolic resin of  claim 60 , wherein the reactive diluent is selected from the group consisting of aniline, substituted anilines, phenol, substituted phenols, furfuryl alcohol, and furfural. 
     
     
         68 . The curable phenolic resin of  claim 60 , wherein the inert solvent diluent is selected from the group consisting of water, methanol, ethanol, 1-propanol, 2-propanol, ethylene glycol, ethylene glycol monomethyl ether, ethylene glycol diethyl ether, and benzyl alcohol. 
     
     
         69 . The curable phenolic resin of  claim 60 , wherein the curing agent comprises 1-imidazolidineethanol, and the organic accelerator/catalyst comprises sodium phenoxide. 
     
     
         70 . The curable phenolic resin of  claim 60 , wherein the total composition is comprised of between 45-85% by weight of resin derived from the phenolic compound and the aldehyde; between 10-60% by weight of hardener; between 0-10% by weight of accelerator/catalyst; and between 0-25% by weight of reactive diluent. 
     
     
         71 . The curable phenolic resin of  claim 60 , wherein upon curing to form a cured resin, the cured resin is a matrix resin in pultrusion applications. 
     
     
         72 . The curable phenolic resin of  claim 60 , wherein upon curing to form a cured resin, the cured resin is a matrix resin in filament winding applications. 
     
     
         73 . The curable phenolic resin of  claim 60 , wherein upon curing to form a cured resin, the cured resin is a matrix resin in bulk molding compound applications. 
     
     
         74 . The curable phenolic resin of  claim 60 , wherein upon curing to form a cured resin, the cured resin is a matrix resin in sheet molding compound applications. 
     
     
         75 . The curable phenolic resin of  claim 60 , wherein upon curing to form a cured resin, the cured resin is a matrix resin in compression molding applications. 
     
     
         76 . The curable phenolic resin of  claim 60 , wherein upon curing to form a cured resin, the cured resin is a matrix resin in prepreg applications. 
     
     
         77 . The curable phenolic resin of  claim 60 , wherein the curing agent is generated in situ from a mixture of its constituent components. 
     
     
         78 . The curable phenolic resin of  claim 77 , wherein a polymeric imidazolidine hardener is generated in situ from a mixture of the polyalkyleneamine Dow Heavy Polyamine X and Formcel®.