Apparatus for forming a wireless communication device

Abstract

A method for manufacturing wireless communication devices for use in tracking or identifying items comprises cutting techniques that allow the size of antenna elements for the wireless communication device to be adjusted. Rollers cut tabs that form the antenna elements. In one embodiment, a plurality of rollers are used, each one effecting a different cut whose position may be adjusted so as to shorten or lengthen the antenna element. In another embodiment, the rollers are independently positionable to shorten or lengthen the antenna element. A radiator may be configured to assess a capacitance of the antenna elements prior to cutting to determine an appropriate size for the antenna elements.

1 . An apparatus for forming a wireless communication device, the apparatus comprising:
 means for cutting a conductive tab to form an antenna element, wherein the means for cutting are positionable relative to the conductive tab to permit adjustable cutting of the conductive tab to obtain a desired electrical characteristic for the antenna element; and   means for securing a wireless communication chip to the conductive tab and to a substrate, which thereby forms the wireless communication device, wherein the means for securing include a heater configured to heat pins of the wireless communication chip to a temperature above a yield point of the substrate so that the pins melt the substrate when inserted into the substrate.   
     
     
         2 . The apparatus of  claim 1 , wherein the means for cutting are configured to receive a production line carrying a series of conductive tabs. 
     
     
         3 . The apparatus of  claim 1 , wherein the conductive tab is a first conductive tab forming a first antenna element, wherein the apparatus further comprises means for cutting a second conductive tab to form a second antenna element, wherein the means for cutting a second conductive tab are positionable relative to the second conductive tab to permit adjustable cutting of the second conductive tab to obtain a desired electrical characteristic for the second antenna element, and wherein the means for securing are configured to secure the wireless communication chip to the second conductive tab. 
     
     
         4 . The apparatus of  claim 3 , wherein the electrical characteristic is impedance, and wherein the means for cutting a second conductive tab are positionable to permit cutting the second conductive tab with an impedance that matches an impedance of the wireless communication chip. 
     
     
         5 . The apparatus of  claim 1 , wherein the means for securing are configured to secure the wireless communication chip to the substrate by insertion of the wireless communication chip into a cavity in the substrate. 
     
     
         6 . The apparatus of  claim 5 , wherein the wireless communication chip is configured to fit inside the cavity such that a surface of the wireless communication chip is coplanar with a surface of the substrate. 
     
     
         7 . The apparatus of  claim 1 , wherein the heater is further configured to heat pins of the wireless communication chip for inserting the pins into a solder paste configured to melt and later harden to secure the wireless communication chip to the conductive tab. 
     
     
         8 . The apparatus of  claim 7 , wherein the conductive tab is preloaded with the solder paste. 
     
     
         9 . The apparatus of  claim 1 , wherein the means for securing are configured to use an adhesive to secure the wireless communication chip to the conductive tab and to the substrate. 
     
     
         10 . The apparatus of  claim 9 , wherein the adhesive is conductive. 
     
     
         11 . The apparatus of  claim 9 , wherein the adhesive is a rapidly-curing adhesive. 
     
     
         12 . The apparatus of  claim 1 , wherein the heater is a hot gas jet. 
     
     
         13 . The apparatus of  claim 1 , wherein the heater is configured to heat the pins using infrared radiation. 
     
     
         14 . The apparatus of  claim 1 , wherein the conductive tab is further configured with fingers that wrap around the pins when the pins are inserted into the substrate. 
     
     
         15 . The apparatus of  claim 1 , wherein the melted substrate forms a mechanical bond around the pins of the wireless communication chip upon cooling. 
     
     
         16 . The apparatus of  claim 1 , wherein the means for securing further comprise a welder configured to pass a high-current, low-voltage electrical pulse through pins of the wireless communication chip to weld the pins of the wireless communication chip to the substrate. 
     
     
         17 . The apparatus of  claim 1 , wherein the means for securing further comprise a welder configured to pass a high-current, low-voltage electrical pulse through a thin foil that melts and secures the wireless communication chip to the substrate. 
     
     
         18 . The apparatus of  claim 1 , wherein the means for securing are configured to place a sealing layer over the substrate and the wireless communication chip to securely hold the wireless communication chip on the substrate. 
     
     
         19 . The apparatus of  claim 18 , wherein the sealing layer comprises a plastic layer. 
     
     
         20 . The apparatus of  claim 18 , wherein the sealing layer comprises an epoxy layer. 
     
     
         21 . The apparatus of  claim 1 , wherein the electrical characteristic is impedance. 
     
     
         22 . The apparatus of  claim 21 , wherein the means for cutting are positionable to permit cutting of the conductive tab with an impedance that matches an impedance of the wireless communication chip. 
     
     
         23 . The apparatus of  claim 1 , wherein the electrical characteristic is capacitance. 
     
     
         24 . The apparatus of  claim 1 , wherein the electrical characteristic is configured to affect an operating frequency of the antenna element. 
     
     
         25 . The apparatus of  claim 1 , wherein the means for cutting comprise at least one of a die, a knife, or a laser. 
     
     
         26 . The apparatus of  claim 1 , wherein the conductive tab is a first tab forming a first antenna element, and wherein the means for cutting comprise:
 means for adjustably cutting the first tab to form the first antenna element; and   means for adjustably cutting a second tab to form a second antenna element; and   wherein the means for securing a wireless communication chip further include means for securing the first and second tabs to the wireless communication chip and to the substrate.   
     
     
         27 . The apparatus of  claim 26 , wherein the means for adjustably cutting the first and second tabs comprise at least two independently-positionable rollers. 
     
     
         28 . The apparatus of  claim 27 , wherein the two independently-positionable rollers are configured to receive a production line comprising a backing material having tabs and a wireless communication chip disposed thereon. 
     
     
         29 . The apparatus of  claim 28 , wherein the means for adjustably cutting the first and second tabs further comprise cutting means to cut the backing material around the wireless communication chip and through the tabs. 
     
     
         30 . The apparatus of  claim 29 , further comprising a radiator configured to assess the capacitance of the first and second tabs prior to cutting to determine an appropriate size for the cut to be made by the cutting means. 
     
     
         31 . The apparatus of  claim 26 , wherein the means for adjustably cutting the first and second tabs comprise three rollers, and wherein each roller is configured to make a cut on a production line. 
     
     
         32 . The apparatus of  claim 31 , wherein a first of the three rollers is configured to make a cut that comprises an interior portion of the first and second antenna elements. 
     
     
         33 . The apparatus of  claim 32 , wherein a second of the three rollers is configured to make a cut that comprises an exterior portion of one of the first or second antenna elements. 
     
     
         34 . The apparatus of  claim 33 , wherein a third of the three rollers is configured to make a cut that comprises an exterior portion of the other of the first or second antenna elements. 
     
     
         35 . The apparatus of  claim 31 , wherein a phase of rotation of the three rollers is configured to be adjusted to vary selectively the size of the first and second antenna elements. 
     
     
         36 . The apparatus of  claim 26 , wherein the means for securing the first and second tabs to the wireless communication chip comprise an adhesive. 
     
     
         37 . The apparatus of  claim 26 , wherein the means for securing the first and second tabs to the wireless communication chip comprise a hot gas jet configured to heat pins of the wireless communication chip prior to coupling to fingers cut into the first and second tabs. 
     
     
         38 . An apparatus for forming a wireless communication device, the apparatus comprising:
 means for cutting a conductive tab to form an antenna element, wherein the means for cutting are positionable relative to the conductive tab to permit adjustable cutting of the conductive tab to obtain a desired electrical characteristic for the antenna element; and   means for securing a wireless communication chip to the conductive tab and to a substrate, which thereby forms the wireless communication device, wherein the means for securing include a heater configured to heat pins of the wireless communication chip for inserting the pins into a solder paste configured to melt and later harden to secure the wireless communication chip to the conductive tab.   
     
     
         39 . The apparatus of  claim 38 , wherein the conductive tab is preloaded with the solder paste. 
     
     
         40 . An apparatus for forming a wireless communication device, the apparatus comprising:
 means for cutting a conductive tab to form an antenna element, wherein the means for cutting are positionable relative to the conductive tab to permit adjustable cutting of the conductive tab to obtain a desired electrical characteristic for the antenna element; and   means for securing a wireless communication chip to the conductive tab and to a substrate, which thereby forms the wireless communication device, wherein the means for securing include a welder configured to pass a high-current, low-voltage electrical pulse through pins of the wireless communication chip to weld the pins of the wireless communication chip to the conductive tab.   
     
     
         41 . An apparatus for forming a wireless communication device, the apparatus comprising:
 means for cutting a conductive tab to form an antenna element, wherein the means for cutting are positionable relative to the conductive tab to permit adjustable cutting of the conductive tab to obtain a desired electrical characteristic for the antenna element; and   means for securing a wireless communication chip to the conductive tab and to a substrate, which thereby forms the wireless communication device, wherein the means for securing include a welder configured to pass a high-current, low-voltage electrical pulse through a thin foil that melts and secures the wireless communication chip to the conductive tab.   
     
     
         42 . A method for producing a wireless communication device, the method comprising:
 cutting a conductive tab using a cutting tool to form an antenna element, wherein the cutting tool is positionable relative to the conductive tab to permit adjustable cutting of the conductive tab to obtain a desired electrical characteristic for the antenna element; and   securing a wireless communication chip to the conductive tab and to a substrate using a mounting tool, thereby forming the wireless communication device, wherein the mounting tool includes a heater configured to heat pins of the wireless communication chip to a temperature above a yield point of the substrate so that the pins melt the substrate when inserted into the substrate.   
     
     
         43 . The method of  claim 42 , further comprising receiving a production line carrying a series of conductive tabs. 
     
     
         44 . The method of  claim 42 , wherein the conductive tab is a first conductive tab forming a first antenna element, wherein the method further comprises cutting a second conductive tab using a second cutting tool to form a second antenna element, wherein the second cutting tool is positionable relative to the second conductive tab to permit adjustable cutting of the second conductive tab to obtain a desired electrical characteristic for the second antenna element, and wherein the method further comprises securing the wireless communication chip to the second conductive tab using the mounting tool. 
     
     
         45 . The method of  claim 44 , wherein the electrical characteristic is impedance, and wherein the second cutting tool is positionable to permit cutting the second conductive tab with an impedance that matches an impedance of the wireless communication chip. 
     
     
         46 . The method of  claim 42 , further comprising securing the wireless communication chip to the substrate by insertion of the wireless communication chip into a cavity in the substrate. 
     
     
         47 . The method of  claim 46 , wherein the wireless communication chip is configured to fit inside the cavity such that a surface of the wireless communication chip is coplanar with a surface of the substrate. 
     
     
         48 . The method of  claim 42 , further comprising heating pins of the wireless communication chip using the heater for inserting the pins into a solder paste configured to melt and later harden to secure the wireless communication chip to the conductive tab. 
     
     
         49 . The method of  claim 48 , wherein the conductive tab is preloaded with the solder paste. 
     
     
         50 . The method of  claim 42 , further comprising using an adhesive to secure the wireless communication chip to the conductive tab and to the substrate. 
     
     
         51 . The method of  claim 50 , wherein the adhesive is conductive. 
     
     
         52 . The method of  claim 50 , wherein the adhesive is a rapidly-curing adhesive. 
     
     
         53 . The method of  claim 42 , wherein the heater is a hot gas jet. 
     
     
         54 . The method of  claim 42 , further comprising heating the pins with the heater using infrared radiation. 
     
     
         55 . The method of  claim 42 , wherein the conductive tab is further configured with fingers that wrap around the pins when the pins are inserted into the substrate. 
     
     
         56 . The method of  claim 42 , wherein the melted substrate forms a mechanical bond around the pins of the wireless communication chip upon cooling. 
     
     
         57 . The method of  claim 42 , wherein said securing a wireless communication chip further comprises using a welder to pass a high-current, low-voltage electrical pulse through pins of the wireless communication chip to weld the pins of the wireless communication chip to the substrate. 
     
     
         58 . The method of  claim 42 , wherein said securing a wireless communication chip further comprises using a welder to pass a high-current, low-voltage electrical pulse through a thin foil that melts and secures the wireless communication chip to the substrate. 
     
     
         59 . The method of  claim 42 , wherein said securing a wireless communication chip further comprises placing a sealing layer over the substrate and the wireless communication chip to securely hold the wireless communication chip on the substrate. 
     
     
         60 . The method of  claim 59 , wherein the sealing layer comprises a plastic layer. 
     
     
         61 . The method of  claim 59 , wherein the sealing layer comprises an epoxy layer. 
     
     
         62 . The method of  claim 42 , wherein the electrical characteristic is impedance. 
     
     
         63 . The method of  claim 62 , further comprising positioning the cutting tool to permit cutting of the conductive tab with an impedance that matches an impedance of the wireless communication chip. 
     
     
         64 . The method of  claim 42 , wherein the electrical characteristic is capacitance. 
     
     
         65 . The method of  claim 42 , wherein the electrical characteristic is configured to affect an operating frequency of the antenna element. 
     
     
         66 . The method of  claim 42 , wherein the cutting tool comprises at least one of a die, a knife, or a laser. 
     
     
         67 . The method of  claim 42 , wherein the conductive tab is a first tab forming a first antenna element, and wherein the method further comprises:
 adjustably cutting the first tab to form the first antenna element;   adjustably cutting a second tab to form a second antenna element; and   securing the first and second tabs to the wireless communication chip and to the substrate.   
     
     
         68 . The method of  claim 67 , wherein adjustably cutting the first and second tabs includes adjustably cutting the first and second tabs using at least two independently-positionable rollers. 
     
     
         69 . The method of  claim 68 , further comprising receiving, using the at least two independently-positionable rollers, a production line comprising a backing material having tabs and a wireless communication chip disposed thereon. 
     
     
         70 . The method of  claim 69 , wherein adjustably cutting the first and second tabs comprises cutting the backing material around the chip and through the tabs. 
     
     
         71 . The method of  claim 70 , further comprising assessing the capacitance of the first and second tabs using a radiator prior to said adjustably cutting to determine an appropriate size for the cuts made by the at least two independently-positionable rollers. 
     
     
         72 . The method of  claim 67 , wherein said adjustably cutting the first and second tabs comprises adjustably cutting the first and second tabs using three rollers, and wherein each roller is configured to make a cut on a production line. 
     
     
         73 . The method of  claim 72 , further comprising making a cut that comprises an interior portion of the first and second antenna elements using a first roller of the three rollers. 
     
     
         74 . The method of  claim 73 , further comprising making a cut that comprises an exterior portion of one of the first or second antenna elements using a second roller of the three rollers. 
     
     
         75 . The method of  claim 74 , further comprising making a cut that comprises an exterior potion of the other of the first or second antenna elements using a third roller of the three rollers. 
     
     
         76 . The method of  claim 72 , wherein a phase of rotation of the three rollers is adjusted to vary selectively the size of the first and second antenna elements. 
     
     
         77 . The method of  claim 67 , wherein said securing the first and second tabs to the wireless communication chip comprises using an adhesive. 
     
     
         78 . The method of  claim 67 , wherein said securing the first and second tabs to the wireless communication chip comprises heating pins of the wireless communication chip using a hot gas jet prior to coupling to fingers cut into the first and second tabs. 
     
     
         79 . A method for forming a wireless communication device, the method comprising:
 cutting a conductive tab using a cutting tool to form an antenna element, wherein the cutting tool is positionable relative to the conductive tab to permit adjustable cutting of the conductive tab to obtain a desired electrical characteristic for the antenna element; and   securing a wireless communication chip to the conductive tab and to a substrate using a mounting tool, thereby forming the wireless communication device, wherein the mounting tool includes a heater configured to heat pins of the wireless communication chip for inserting the pins into a solder paste configured to melt and later harden to secure the wireless communication chip to the tab.   
     
     
         80 . The method of  claim 79 , wherein the conductive tab is preloaded with the solder paste. 
     
     
         81 . A method for forming a wireless communication device, the method comprising:
 cutting a conductive tab using a cutting tool to form an antenna element, wherein the cutting tool is positionable relative to the conductive tab to permit adjustable cutting of the conductive tab to obtain a desired electrical characteristic for the antenna element; and   securing a wireless communication chip to the conductive tab and to a substrate using a mounting tool, thereby forming the wireless communication device, wherein the mounting tool includes a welder configured to pass a high-current, low-voltage electrical pulse through pins of the wireless communication chip to weld the pins of the wireless communication chip to the conductive tab.   
     
     
         82 . A method for forming a wireless communication device, the method comprising:
 cutting a conductive tab using a cutting tool to form an antenna element, wherein the cutting tool is positionable relative to the conductive tab to permit adjustable cutting of the conductive tab to obtain a desired electrical characteristic for the antenna element; and   securing a wireless communication chip to the conductive tab and to a substrate using a mounting tool, thereby forming the wireless communication device, wherein the mounting tool includes a welder configured to pass a high-current, low-voltage electrical pulse through a thin foil that melts and secures the wireless communication chip to the conductive tab.