US2012132530A1PendingUtilityA1

Tin plating solution

Assignee: HAYASHI SHINJIROPriority: Oct 22, 2010Filed: Oct 22, 2011Published: May 31, 2012

Est. expiryOct 22, 2030(~4.3 yrs left)· nominal 20-yr term from priority

Inventors:Shinjiro Hayashi Makoto Sakai Mutsuko Saito

C25D 3/30C25D 3/32H05K 3/062

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References

Claims

Abstract

To provide a tin plating solution having uniformity of through-hole plating, uniformity of film thickness distribution and no burn deposits even. The tin plating solution include a tin ion source, at least one non-ionic surfactant, imidazoline dicarboxylate and 1,10-phenanthroline.

Claims

exact text as granted — not AI-modified

1 . A tin plating solution comprising a tin ion source, at least one non-ionic surfactant, imidazoline dicarboxylate and 1,10-phenanthroline. 
     
     
         2 . The tin plating solution according to  claim 1 , wherein the non-ionic surfactant comprises a polyalkylene oxide group. 
     
     
         3 . The tin plating solution according to  claim 1  or  2 , further comprising an antioxidant. 
     
     
         4 . A method for plating on a printed board having through-holes and fine patterns, wherein the tin plating solution of any of  claims 1  to  3  is used to form a metal resist.

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