Moisture removal for gasification quench chamber assembly
Abstract
A gasification assembly that includes a quench chamber and downstream transfer piping is disclosed. The gasification assembly includes the quench chamber and a liquid coolant disposed therein, and a dip tube that is configured to couple a combustion chamber to the quench chamber and also configured to direct syngas from the combustion chamber to the liquid coolant and produce a cooled syngas. The assembly further includes a transfer pipe that is in fluid communication with the cooled syngas and configured to transfer the cooled syngas to a downstream scrubber component. The transfer pipe further includes an excess moisture removal device, which is configured to remove moisture from the cooled syngas.
Claims
exact text as granted — not AI-modified1 . A gasification assembly comprising:
a quench chamber having a liquid coolant disposed therein; a dip tube configured to couple a combustion chamber to the quench chamber and configured to direct syngas from the combustion chamber to the liquid coolant and produce a cooled syngas; and a transfer pipe in fluid communication with the cooled syngas, configured to transfer the cooled syngas to a downstream scrubber component, wherein the transfer pipe further comprises an excess moisture removal device, configured to remove moisture from the cooled syngas.
2 . The gasification assembly of claim 1 , wherein the excess moisture removal device is configured to employ centrifugal action to remove moisture from the cooled syngas.
3 . The gasification assembly of claim 2 , wherein the excess moisture removal device comprises a baffle.
4 . The gasification assembly of claim 1 , further comprising a return line in fluid communication between the moisture removal device and the quench chamber configured to return a portion of the removed moisture to the liquid coolant.
5 . The gasification assembly of claim 1 , wherein the excess moisture removal device injects a fluid at the exiting syngas, wherein the fluid has a higher temperature than the exiting syngas, thereby evaporating a portion of the moisture.
6 . The gasification assembly of claim 5 , wherein the fluid is a hot syngas.
7 . The gasification assembly of claim 6 , wherein the fluid is provided from a gas turbine.
8 . The gasification assembly of claim 1 , wherein the excess moisture removal device comprises a plurality of perforations configured to allow egress of the removed moisture from the transfer pipe.
9 . The gasification assembly of claim 8 , further comprising a return line in fluid communication between the plurality of perforations and the quench chamber configured to return a portion of the removed moisture to the liquid coolant.
10 . The gasification assembly of claim 8 , wherein the plurality of perforations are in fluid communication with a reservoir.
11 . The gasification assembly of claim 8 , further comprising a cooling device in fluid communication with one of the transfer pipe and the excess moisture removal device, configured to condense moisture from the cooled syngas.
12 . The gasification assembly of claim 11 , wherein the cooling device comprises a sleeve partially surrounding a portion of the transfer pipe, further wherein the sleeve has a fluid therein having a temperature less than a temperature of the cooled syngas in the transfer pipe.Join the waitlist — get patent alerts
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