Semiconductor device assemblies including elongated fasteners

Abstract

Semiconductor device assemblies include elements such as electronic components and substrates secured together by a fastener that includes an elongated portion extending continuously through an aperture in two or more such elements. Computer systems include such semiconductor device assemblies. Fasteners for securing together such elements include an elongated portion, a first end piece, and a second end piece. Methods of securing together a plurality of semiconductor devices include inserting an elongated portion of a fastener through an aperture in a first semiconductor device and an aperture in at least one additional semiconductor device. Circuit boards include a plurality of apertures disposed in an array corresponding to an array of apertures in a semiconductor device assembly. Each aperture is sized and configured to receive a fastener for maintaining an assembled relationship between the semiconductor device assembly and the circuit board.

1 . A semiconductor device assembly comprising:
 a first electronic component having at least one aperture extending therethrough;   at least one additional electronic component having at least one aperture extending therethrough; and   at least one fastener configured to at least partially secure together the first electronic component and the at least one additional electronic component, the at least one fastener comprising:
 an elongated portion extending continuously through the at least one aperture extending through the first electronic component and the at least one aperture extending through the at least one additional electronic component; and 
 at least one end piece secured to an end of the elongated portion by at least one of a weld and press fit. 
   
     
     
         2 . The semiconductor device assembly of  claim 1 , wherein the first electronic component and the second electronic component each comprises one of an electronic component and a semiconductor device package. 
     
     
         3 . The semiconductor device assembly of  claim 1 , wherein the at least one aperture extending through the first electronic component and the at least one aperture extending through the at least one additional electronic component each have a cross-sectional shape that is selected from the group consisting of circular, triangular, rectangular, pentagonal, and hexagonal, the at least one aperture extending through the at least one additional electronic component being aligned with the at least one aperture extending through the first electronic component. 
     
     
         4 . The semiconductor device assembly of  claim 3 , wherein the elongated portion of the at least one fastener is substantially cylindrical. 
     
     
         5 . The semiconductor device assembly of  claim 1 , wherein at least the elongated portion of the at least one fastener is electrically conductive. 
     
     
         6 . The semiconductor device assembly of  claim 1 , wherein the elongated portion of the at least one fastener comprises at least a portion that is electrically conductive and at least a portion that is electrically nonconductive. 
     
     
         7 . The semiconductor device assembly of  claim 5 , wherein the elongated portion of the at least one fastener is configured to electrically communicate with an integrated circuit of at least one of the first electronic component and the at least one additional electronic component. 
     
     
         8 . The semiconductor device assembly of  claim 7 , wherein the elongated portion of the at least one fastener comprises at least one conductive protrusion extending from a lateral surface of the at least one fastener, the conductive protrusion configured to communicate electrically with a conductive structure of at least one of the first electronic component and the at least one additional electronic component. 
     
     
         9 . The semiconductor device assembly of  claim 8 , wherein at least one of the aperture extending through the first electronic component and the aperture extending through the second electronic component extends through a conductive via. 
     
     
         10 . The semiconductor device assembly of  claim 8 , wherein at least one of the aperture extending through the first electronic component and the aperture extending through the second electronic component extends through a conductive terminal or pad. 
     
     
         11 . The semiconductor device assembly of  claim 1 , wherein at least the elongated portion of the at least one fastener is electrically non-conductive. 
     
     
         12 . The semiconductor device assembly of  claim 11 , wherein at least the elongated portion of the at least one fastener comprises a polymer. 
     
     
         13 . The semiconductor device assembly of  claim 1 , wherein the at least one fastener further comprises an integral end piece integrally formed with the elongated portion, the integral end piece being disposed at an end of the elongated portion and sized and configured to prevent the integral end piece from passing through the at least one aperture extending through the first electronic component and the at least one aperture extending through the at least one additional electronic component. 
     
     
         14 . The semiconductor device assembly of  claim 1 , wherein the at least one endpiece of the at least one fastener further comprises a discrete end piece, the discrete end piece being sized and configured to prevent the discrete end piece from passing through the at least one aperture extending through the first electronic component and the at least one aperture extending through the at least one additional electronic component. 
     
     
         15 . The semiconductor device assembly of  claim 14 , wherein the discrete end piece has an aperture extending therethrough from a first end thereof to a second end thereof, the aperture extending through the discrete end piece being size and configured to allow the end of the elongated portion to slide at least partially therethrough. 
     
     
         16 . The semiconductor device assembly of  claim 14 , wherein the discrete end piece is secured to the end of the elongated portion at least partially by mechanical interference. 
     
     
         17 . The semiconductor device assembly of  claim 16 , wherein the elongated portion of the at least one fastener comprises at least one protrusion on a surface thereof, and wherein the discrete end piece comprises at least one protrusion on a surface thereof within the aperture extending therethrough, mechanical interference between the at least one protrusion on the fastener and the at least one protrusion on the discrete end piece at least partially securing the discrete end piece to the end of the elongated portion. 
     
     
         18 . The semiconductor device assembly of  claim 1 , wherein the end piece is welded to the end of the elongated portion. 
     
     
         19 . The semiconductor device assembly of  claim 18 , wherein the end piece is ultrasonically welded to the end of the elongated portion. 
     
     
         20 . The semiconductor device assembly of  claim 14 , wherein the end piece is secured to the end of the elongated portion using an adhesive. 
     
     
         21 . The semiconductor device assembly of  claim 1 , further comprising a substrate having at least one aperture extending therethrough, the elongated portion of the at least one fastener extending continuously through the at least one aperture extending through the substrate, the at least one fastener at least partially securing together the first electronic component, the at least one additional electronic component, and the substrate. 
     
     
         22 . The semiconductor device assembly of  claim 21 , wherein the end piece of the at least one fastener is at least partially disposed in a recessed portion of the at least one substrate. 
     
     
         23 . The semiconductor device assembly of  claim 1 , wherein the first electronic component has a plurality of apertures extending therethrough, the at least one additional electronic component has a plurality of apertures extending therethrough, and the at least one fastener comprises a plurality of fasteners, each fastener comprising an elongated portion extending continuously through an aperture extending through the first electronic component and an aperture extending through the at least one additional electronic component, each fastener of the plurality at least partially securing together the first electronic component and the at least one additional electronic component. 
     
     
         24 . The semiconductor device assembly of  claim 1 , wherein the at least one additional electronic component is disposed adjacent to and laterally offset from the first electronic component. 
     
     
         25 . The semiconductor device assembly of  claim 1 , further comprising an encapsulation material at least partially surrounding the first electronic component and the at least one additional electronic component.