Heat sink

Abstract

A heat sink allowing circuit elements to be simply coupled thereto and allowing a size and a thickness thereof to be adjusted according to the number and capacity of circuit elements. The heat sink includes: a support plate; a plurality of heat radiation pins vertically protruded from one surface of the support plate; an element insertion groove formed to be depressed in a longitudinal direction from the other surface of the support plate; and element support parts formed to be protruded from the element insertion groove and supporting a circuit element. The circuit element slides and is coupled thereto. In addition, the circuit element is freely moved, thereby making it possible to simply correct mounting position.

1 . A heat sink comprising:
 a support plate;   a plurality of heat radiation pins vertically protruded from one surface of the support plate;   an element insertion groove formed to be depressed in a longitudinal direction from the other surface of the support plate; and   element support parts formed to be protruded from the element insertion groove and supporting a circuit element.   
     
     
         2 . The heat sink according to  claim 1 , wherein an inner side of the element support part supporting the circuit element is formed to be inclined. 
     
     
         3 . The heat sink according to  claim 1 , wherein the element support part is formed to be bent in a ‘└’ shape. 
     
     
         4 . The heat sink according to  claim 1 , further comprising:
 a protrusion part formed to be protruded from one side of the support plate; and   a groove formed to be depressed from the other side of the support plate.   
     
     
         5 . The heat sink according to  claim 4 , wherein the protrusion part and the groove have the same width, and the groove has a depth that is the same as a protruded length of the protrusion part. 
     
     
         6 . The heat sink according to  claim 1 , wherein the support plate includes longitudinal grooves formed in a longitudinal direction thereof in a bottom surface thereof, and a longitudinal groove formed at an outermost side among the longitudinal grooves is formed of a step part. 
     
     
         7 . The heat sink according to  claim 6 , wherein the longitudinal groove has the same width as that of the heat radiation pin. 
     
     
         8 . The heat sink according to  claim 1 , wherein the heat radiation pin includes a horizontal protrusion formed on an inner side or an outer side thereof in order to increase a heat radiation area.