Heat dissipation plate for projection-type ic package

Abstract

The present invention relates to a heat dissipation plate for a projection-type integration circuit (IC) package, which is installed to be adhered and fixed to a projection-type IC package in which an integration circuit in a board is formed to project, so as to dissipate heat generated by the integrated circuit, including: a fixed plate adhered and fixed to the projection-type IC package; and heat dissipation fins (cooling fins) formed to be inclined upward from both opposing sides of the fixed plate, wherein an accommodation groove that accommodates the integrated circuit is formed in a rear surface of the fixed plate, and the accommodation groove is formed to have a shape to be joined to the integrated circuit, and the integrated circuit comes into close contact with the accommodation groove. Therefore, there are advantages in that the heat dissipation plate can enhance not only heat dissipation efficiency but also adhesion performance by increasing the contact area with the projection-type IC package, and simultaneously can be simply produced, thereby reducing production costs.

1 . A heat dissipation plate for a projection-type integration circuit (IC) package, which is installed to be adhered and fixed to a projection-type IC package in which an integration circuit in a board is formed to project, so as to dissipate heat generated by the integrated circuit, comprising:
 a fixed plate adhered and fixed to the projection-type IC package; and   heat dissipation fins (cooling fins) formed to be inclined upward from both opposing sides of the fixed plate,   wherein an accommodation groove that accommodates the integrated circuit is formed in a rear surface of the fixed plate, and   the accommodation groove is formed to have a shape to be joined to the integrated circuit, and the integrated circuit comes into close contact with the accommodation groove.   
     
     
         2 . The heat dissipation plate according to  claim 1 , wherein the accommodation groove is formed by a press process. 
     
     
         3 . The heat dissipation plate according to  claim 1 ,
 wherein a surface of the fixed plate is provided with a projection portion formed to project from the surface,   the projection portion includes a projection surface, and a projection connection surface formed along a periphery of the projection surface, and   the projection connection surface is formed to be inclined with respect to the projection surface and the surface of the fixed plate.   
     
     
         4 . The heat dissipation plate according to  claim 1 , wherein an angle between the fixed plate and the heat dissipation plate is greater than 90 degrees and is equal to or smaller than 150 degrees. 
     
     
         5 . The heat dissipation plate according to  claim 1 , wherein the heat dissipation fin is provided with a plurality of though-holes.