Semiconductor device

Abstract

An electric device includes: a first electric element; a second electric element capable of flowing large current therethrough so that heat is generated in the second electric element; a heat sink; and a first wiring board and a second wiring board, which are disposed on one side of the heat sink. The large current in the second electric element is larger than that in the first electric element. The first wiring board and the second wiring board are separated each other. The first electric element is disposed on the first wiring board, and the second electric element is disposed on the second wiring board.

1 . An electric device comprising:
 a first electric element;   a second electric element capable of flowing large current therethrough so that heat is generated in the second electric element;   a heat sink; and   a first wiring board disposed on one side of the heat sink,   wherein the large current in the second electric element is larger than that in the first electric element,   wherein the first electric element is disposed on the first wiring board,   wherein the second electric element is disposed on the heat sink,   wherein the second electric element temporarily generates heat, and   wherein the heat sink temporarily stores heat temporarily generated from the second electric element thereby preventing heat transfer to the first electric element.   
     
     
         2 . The electric device according to  claim 1 , further comprising:
 a signal terminal,   wherein the first electric element, the second electric element, the first wiring board, and the heat sink are molded with a resin mold,   wherein the signal terminal is disposed on a side of the resin mold,   wherein the signal terminal is coupled with the first electric element or the second electric element via a bonding wire, and   wherein the signal terminal is detached from the heat sink.   
     
     
         3 . An electric device comprising:
 a first electric element;   a second electric element capable of flowing large current therethrough so that heat is generated in the second electric element;   a heat sink; and   a first wiring board disposed on one side of the heat sink,   wherein the large current in the second electric element is larger than that in the first electric element,   wherein the first electric element is disposed on the first wiring board,   wherein the second electric element is disposed on the heat sink,   wherein the heat sink is made of material having a coefficient of thermal expansion equal to 12×10 −6 /° C.,   wherein the second electric element temporarily generates heat, and   wherein the heat sink temporarily stores heat temporarily generated from the second electric element thereby preventing heat transfer to the first electric element.   
     
     
         4 . The electric device according to  claim 3 , further comprising:
 a signal terminal,   wherein the first electric element, the second electric element, the first wiring board, and the heat sink are molded with a resin mold,   wherein the signal terminal is disposed on a side of the resin mold,   wherein the signal terminal is coupled with the first electric element or the second electric element via a bonding wire, and   wherein the signal terminal is detached from the heat sink.   
     
     
         5 . An electric device comprising:
 a first electric element;   a second electric element capable of flowing large current therethrough so that heat is generated in the second electric element; and   a heat sink,   wherein the large current in the second electric element is larger than that in the first electric element,   wherein the first electric element is disposed on the heat sink,   wherein the second electric element is disposed on the heat sink,   wherein the second electric element temporarily generates heat, and   wherein the heat sink temporarily stores heat temporarily generated from the second electric element thereby preventing heat transfer to the first electric element.   
     
     
         6 . The electric device according to  claim 5 , further comprising:
 a signal terminal,   wherein the first electric element, the second electric element, and the heat sink are molded with a resin mold,   wherein the signal terminal is disposed on a side of the resin mold,   wherein the signal terminal is coupled with the first electric element or the second electric element ( 20 ) via a bonding wire, and   wherein the signal terminal is detached from the heat sink.   
     
     
         7 . An electric device comprising:
 a first electric element;   a second electric element capable of flowing large current therethrough so that heat is generated in the second electric element; and   a heat sink,   wherein the large current in the second electric element is larger than that in the first electric element,   wherein the first electric element is disposed on the heat sink,   wherein the second electric element is disposed on the heat sink,   wherein the heat sink is made of material having a coefficient of thermal expansion equal to 12×10 −6 /° C.,   wherein the second electric element temporarily generates heat, and   wherein the heat sink temporarily stores heat temporarily generated from the second electric element thereby preventing heat transfer to the first electric element.   
     
     
         8 . The electric device according to  claim 7 , further comprising:
 a signal terminal,   wherein the first electric element, the second electric element, and the heat sink are molded with a resin mold,   wherein the signal terminal is disposed on a side of the resin mold,   wherein the signal terminal is coupled with the first electric element or the second electric element via a bonding wire, and   wherein the signal terminal is detached from the heat sink.