Heat dissipation structure

Abstract

A heat dissipation structure mounted onto an electronic element to dissipate heat. The heat dissipation structure includes a heat absorber connected with the electronic element and a heat sink. The heat absorber has a hollow first chamber to hold a working fluid. The heat absorber and heat sink are interposed by a plurality of first conduits. When the heat absorber absorbs heat generated by the electronic element through a contact surface, the working fluid held therein is vaporized into vapor. The vapor enters a second chamber of the heat sink through the first conduits and performs heat exchange with a cooling surface of the heat sink to be converted into the working fluid again. The working fluid is conveyed via a capillary structure in the second conduit to the first chamber to form a thermal cycle. The structure of the invention is simpler and can rapidly absorb and dissipate heat.

1 . A heat dissipation structure for dissipating heat from an electronic element, comprising:
 a heat absorber which includes a contact surface connected to the electronic element and a hollow first chamber to hold a working fluid, the heat absorber absorbing heat generated by the electronic element through the contact surface and transferring the heat to the working fluid to be vaporized into vapor;   a heat sink which includes a cooling surface and a hollow second chamber; and   a plurality of first conduits and a second conduit that respectively communicate with the first chamber and the second chamber, the vapor entering the second chamber through the first conduits and being in contact with the cooling surface to perform heat exchange to be condensed into the working fluid again; the second conduit holding a capillary structure to convey the condensed working fluid from the second chamber to the first chamber to form a thermal cycle.   
     
     
         2 . The heat dissipation structure of  claim 1 , wherein the capillary structure is selected from the group consisting of sintered powders, metal fibers, metal meshes, grooves and cotton fabrics. 
     
     
         3 . The heat dissipation structure of  claim 1 , wherein the cooling surface of the heat sink is connected with a radiation fin. 
     
     
         4 . The heat dissipation structure of  claim 1 , wherein the working fluid is a refrigerant. 
     
     
         5 . The heat dissipation structure of  claim 1 , wherein the working fluid is selected from the group consisting of pure water, methanol, ethanol, acetone and heptane. 
     
     
         6 . The heat dissipation structure of  claim 1 , wherein the second conduit includes two ends formed respectively a flow conduction portion which is formed in a chamfer shape to facilitate flowing of the working fluid into the second conduit. 
     
     
         7 . The heat dissipation structure of  claim 1 , wherein the heat absorber and the heat sink include respectively a plurality of first coupling orifices and second coupling orifices to respectively connect with the first conduits and the second conduit. 
     
     
         8 . The heat dissipation structure of  claim 7 , wherein the heat sink includes an inclined wall inclined downwards from one edge thereof towards the second coupling orifices.