Micrometric direct-write methods for patterning conductive material and applications to flat panel display repair

Abstract

A method for direct-write patterning comprises providing a cantilever having a cantilever end, wherein the cantilever is a tipless cantilever; providing an ink disposed at the cantilever end; providing a substrate surface; and moving the cantilever end or moving the substrate surface so that ink is delivered from the cantilever end to the substrate surface. A method for direct writing of conductive metal or metal precursor comprises providing a tipless cantilever having a cantilever end; providing an ink disposed at the cantilever end, wherein the ink comprises one or more metals, one or more metallic nanoparticles, or one or more metal salts; providing a substrate surface; and contacting the cantilever end and the substrate surface so that ink is delivered from the cantilever end to the substrate surface.

1 . A method comprising
 providing a cantilever having a cantilever end, wherein the cantilever is a tipless cantilever;   providing an ink disposed at the cantilever end;   providing a substrate surface;   moving the cantilever end or moving the substrate surface so that ink is delivered from the cantilever end to the substrate surface.   
     
     
         2 . The method according to  claim 1 , wherein the substrate surface is moved and the cantilever is stationary. 
     
     
         3 . The method according to  claim 1 , wherein the substrate surface is stationary and the cantilever is moved. 
     
     
         4 . The method according to  claim 1 , wherein the substrate is a flat panel display substrate. 
     
     
         5 . The method according to  claim 1 , wherein the ink comprises one or more metals, metal salts, or metal nanoparticles. 
     
     
         6 . The method according to  claim 1 , wherein the ink comprises one or more solvents having a boiling point over 100° C. 
     
     
         7 . The method according to  claim 1 , wherein the ink forms a feature on the substrate surface which has a dimension controlled by the geometry of the cantilever. 
     
     
         8 . The method according to  claim 1 , wherein the ink forms a feature on the substrate surface which has a width of about one micron to about 100 microns. 
     
     
         9 . The method according to  claim 1 , wherein the ink forms a feature on the substrate surface and the feature is subjected to fusion, sintering, or coalescence conditions. 
     
     
         10 . The method according to  claim 1 , wherein the ink forms a feature on the substrate surface and the feature is subjected to annealing. 
     
     
         11 . The method according to  claim 1 , wherein the ink forms a feature on the substrate surface and the feature is subjected to light. 
     
     
         12 . The method according to  claim 1 , wherein the ink forms a feature on the substrate surface and the feature is subjected to laser curing. 
     
     
         13 . The method according to  claim 1 , wherein the ink forms a feature on the substrate surface which is made continuous after contacting. 
     
     
         14 . The method according to  claim 1 , wherein the ink forms a feature on the substrate surface which is converted to a metallic state which has a resistivity of about 10 microohm.cm or less. 
     
     
         15 . The method according to  claim 1 , wherein the ink forms a feature on the substrate surface which has a width of about 5 nm to about one micron. 
     
     
         16 . The method according to  claim 1 , wherein the method is repeated to form layers of ink on the substrate surface. 
     
     
         17 . The method according to  claim 1 , wherein the cantilever comprises an ink storage slit or channel. 
     
     
         18 . The method according to  claim 1 , wherein the cantilever has a width of about one micron to about 100 microns, and a length of about 100 microns to about 400 microns. 
     
     
         19 . The method according to  claim 1 , wherein the cantilever has a width of about five microns to about 25 microns. 
     
     
         20 . The method according to  claim 1 , wherein the cantilever is a straight beam shaped cantilever and the cantilever is pulled rather than pushed. 
     
     
         21 . The method according to  claim 1 , wherein the method is used for thin film transistor repair. 
     
     
         22 . The method according to  claim 1 , wherein the cantilever is one of a plurality of cantilevers which deposit ink in parallel. 
     
     
         23 . The method according to  claim 1 , wherein the ink is a polyol ink. 
     
     
         24 . The method according to  claim 1 , wherein the ink comprises metal salts together with one or more alcohols or polyols. 
     
     
         25 . The method according to  claim 1 , wherein the ink forms features on the substrate surface having a lateral dimension of about one micron to about 15 microns. 
     
     
         26 . The method according to  claim 1 , wherein the ink forms features on the substrate surface which have a lateral dimension of about one micron to about 10 microns. 
     
     
         27 . The method according to  claim 1 , wherein the ink forms features on the substrate surface which have a lateral dimension of about one micron to about 15 microns. 
     
     
         28 - 38 . (canceled) 
     
     
         39 . A method for direct writing of conductive metal or metal precursor comprising
 providing a tipless cantilever having a cantilever end;   providing an ink disposed at the cantilever end, wherein the ink comprises one or more metals, one or more metallic nanoparticles, or one or more metal salts;   providing a substrate surface;   contacting the cantilever end and the substrate surface so that ink is delivered from the cantilever end to the substrate surface.   
     
     
         40 . The method according to  claim 39 , wherein the cantilever is pulled rather than pushed. 
     
     
         41 . The method according to  claim 39 , wherein the tipless cantilever is part of an array of cantilevers. 
     
     
         42 . The method according to  claim 39 , wherein the ink comprises metallic nanoparticles. 
     
     
         43 . The method according to  claim 39 , wherein the ink after delivery to the substrate surface is cured. 
     
     
         44 . The method according to  claim 39 , wherein the ink after deliver to the substrate surface is cured at a temperature of about 300° C. or less. 
     
     
         45 . A method comprising depositing metallic traces from a tipless cantilever loaded with nanoparticle ink across an insulating gap between conductive materials. 
     
     
         46 - 50 . (canceled)