Led package having an array of light emitting cells coupled in series

Abstract

Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.

1 . A light emitting diode (LED) package, comprising:
 a package body comprising an opening;   a first lead electrode and a second lead electrode arranged in the opening and being spaced apart from each other; and   a light emitting device arranged in the opening and electrically connected to the first lead electrode and the second lead electrode;   wherein the LED package is configured to be driven by an alternating current (AC) and by a voltage higher than that for driving one light emitting diode.   
     
     
         2 . The LED package of  claim 1 , wherein the light emitting device is spaced apart from the first lead electrode and the second lead electrode. 
     
     
         3 . The LED package of  claim 2 , further comprising:
 a first wire and a second wire electrically connecting the light emitting device to the first lead electrode and the second lead electrode, respectively.   
     
     
         4 . The LED package of  claim 3 , further comprising:
 a heat conductor arranged in the opening,   wherein the light emitting device is arranged on the heat conductor.   
     
     
         5 . The LED package of  claim 4 , wherein the heat conductor comprises a metallic material. 
     
     
         6 . The LED package of  claim 1 , further comprising:
 a first molding member configured to convert a direction of light and/or a wavelength of light emitted from the light emitting device.   
     
     
         7 . The LED package of  claim 6 , wherein the first molding member comprises a phosphor. 
     
     
         8 . The LED package of  claim 7 , wherein the first molding member is arranged in the opening, the first molding member encapsulating the light emitting device. 
     
     
         9 . The LED package of  claim 7 , further comprising:
 a phosphor-free second molding member.   
     
     
         10 . The LED package of  claim 9 , wherein the second molding member comprises a diffuser. 
     
     
         11 . The LED package of  claim 10 , further comprising:
 a third molding member arranged above the first molding member and the second molding member, the third molding member comprising a lens shape.   
     
     
         12 . The LED package of  claim 1 , wherein a sidewall of the package body comprises an inclined surface. 
     
     
         13 . The LED package of  claim 1 , wherein the light emitting device is flip bonded. 
     
     
         14 . The LED package of  claim 1 , wherein the light emitting device comprises a plurality of light emitting cells electrically connected to one another in series. 
     
     
         15 . The LED package of  claim 1 , further comprising:
 a bridge rectifier, the bridge rectifier to rectify the AC.