Encapsulated circuit device for substrates having an absorption layer, and method for the manufacture thereof

Abstract

An encapsulated circuit device has a substrate, components configured on a substrate surface portion of a component side of the substrate, an encapsulation, at least one electrical contact having an outer portion projecting out of the encapsulation and an inner portion provided in the circuit device that is electrically connected to the substrate. The encapsulation includes a rigid outer encapsulation, which extends completely around the substrate, the components and the inner portion of the at least one electrical contact, as well as a compressible deformation absorption layer, which is provided between the components and the outer encapsulation and at least completely covers the substrate surface portion on which the components are configured.

1 - 10 . (canceled) 
     
     
         11 . An encapsulated circuit device, comprising:
 a substrate;   a plurality of components configured on a substrate surface portion of a component side of the substrate;   an encapsulation; and   at least one electrical contact having an outer portion projecting out of the encapsulation and an inner portion which is inside the encapsulation and is electrically connected to the substrate;   wherein the encapsulation includes a rigid outer encapsulation and a compressible absorption layer, the rigid outer encapsulation completely surrounding the substrate, the components; and the inner portion of the at least one electrical contact, and wherein the compressible absorption layer is provided between the components and the outer encapsulation, the compressible absorption layer covering at least a Portion of the substrate surface portion on which the components are configured, and wherein the compressible absorption layer is configured to absorb at least a portion of a deformation resulting from thermally-induced movement of the Substrate surface and the components relative to the outer encapsulation.   
     
     
         12 . The circuit device as recited in  claim 11 , wherein the compressible absorption layer covers the entire substrate surface portion of the component side of the substrate. 
     
     
         13 . The circuit device as recited in  claim 11 , wherein the compressible absorption layer has: i) at every location, a thickness in the range between 50 μm and 3 mm; and ii) an elasticity modulus less than 1/10 of the elasticity modulus of the rigid outer encapsulation. 
     
     
         14 . The circuit device as recited in  claim 12 , wherein the compressible absorption layer includes at least one of a silicon material, an electrically insulating gel, a soft plastic material, and a synthetic resin. 
     
     
         15 . The circuit device as recited in  claim 11 , further comprising:
 a cap;   wherein the compressible absorption layer is provided only on the component side of the substrate, and wherein the cap and the component side of the substrate enclose at least a portion of the compressible absorption layer, and wherein the cap has an inner surface at least partially in direct physical contact with a surface of the compressible absorption layer opposing the substrate.   
     
     
         16 . A method for manufacturing an encapsulated circuit device having a substrate, a plurality of components, at least one electrical contact, and an encapsulation, the method comprising:
 providing the components on a substrate surface portion of a component side of the substrate;   affixing an inner portion of the at least one electrical contact to the substrate for electrically connecting the contact to the substrate; and   enclosing the substrate with the encapsulation, the encapsulation including a compressible absorption layer and a rigid outer encapsulation layer, wherein the enclosing includes:   applying the compressible absorption layer to the components and to at least one substrate surface portion on which the components are provided, such that the components and the at least one substrate surface portion are completely covered by the absorption layer; and   applying the rigid outer encapsulation layer to the entire applied absorption layer and to the entire substrate such that the inner portion of the at least one electrical contact is completely surrounded by the encapsulation and an outer portion of the at least one electrical contact projects out of the encapsulation;   wherein the absorption layer includes a compressible material such that the absorption layer is configured to absorb at least a portion of deformation resulting from a thermally-induced movement of the substrate surface and the components relative to the outer encapsulation layer.   
     
     
         17 . The method as recited in  claim 16 , wherein the compressible absorption layer covers the entire substrate surface portion of the component side of the substrate. 
     
     
         18 . The method as recited in  claim 16 , wherein the compressible absorption layer has: i) at every location, a thickness in the range between 50 μM and 3 mm; and ii) an elasticity modulus less than 1/10 of the elasticity modulus of the rigid outer encapsulation. 
     
     
         19 . The method as recited in  claim 18 , wherein the application of the absorption layer includes:
 one of i) immersion into a liquid or flowable absorption layer material, ii) spray deposition of the liquid or flowable absorption layer material, or iii) extrusion-coating or stamping-on the liquid or flowable absorption layer material; and   curing the absorption layer material to form the absorption layer by one of cooling, cross-linking, UV curing, or heat curing.   
     
     
         20 . The method as recited in  claim 16 , further comprising:
 providing a cap on the absorption layer prior to the application of the rigid outer encapsulation layer;   wherein the absorption layer is provided only on the component side of the substrate, and wherein the cap and the component side of the substrate enclose the entire absorption layer, and wherein the cap has an inner surface at least partially in direct physical contact with a surface of the absorption layer opposing the substrate.