Image sensor module

Abstract

An image sensor module including: a lower substrate having a plurality of top pads formed on the top surface thereof; an upper substrate that is installed along the edge of the top surface of the lower substrate and has a plurality of connection grooves formed on the inner side surface thereof, each connection groove having a side pad corresponding to each of the top pads of the lower substrate; an image sensor installed on the top surface of the upper substrate; and a connection element that electrically connects the top pads and the side pads.

1 . An image sensor module comprising:
 a lower substrate having a plurality of top pads formed on the top surface thereof;   an upper substrate that is installed along the edge of the top surface of the lower substrate and has a plurality of connection grooves formed on the inner side surface thereof, each connection groove having a side pad corresponding to each of the top pads of the lower substrate;   an image sensor installed on the top surface of the upper substrate; and   a connection element that electrically connects the top pads and the side pads.   
     
     
         2 . The image sensor module according to  claim 1 , wherein the connection element is composed of solder which is provided on the top pads of the lower substrate and the side pads of the upper substrate through a surface mounting technology (SMT). 
     
     
         3 . The image sensor module according to  claim 1 , wherein the connection element is composed of conductive paste which is bonded to the top pads of the lower substrate and the side pads of the upper substrate. 
     
     
         4 . The image sensor module according to  claim 1 , wherein the upper substrate is formed in a rectangular ring shape corresponding to the edge of the top surface of the lower substrate. 
     
     
         5 . The image sensor module according to  claim 1 , wherein the upper substrate is formed in a shape corresponding to one side, two sides facing each other, or three adjacent sides among four sides of the edge of the top surface of the lower substrate.