Heat spreader with mechanically secured heat coupling element

Abstract

A heat spreader for dissipating heat generated by at least one heat-generating power semiconductor device. Such a heat spreader comprises a base plate ( 11 ) which is connectable in a heat-conducting manner to the at least one power semiconductor device ( 2 ), and at least one heat coupling element ( 4 ) which is connected in a heat conducting manner to the at least one power semiconductor device ( 2 ) on the one hand and to the base plate ( 11 ) on the other hand and comprises at least one elastic layer ( 5 ). The heat coupling element ( 4 ) comprises at least one holding element for mechanically fixing the heat coupling element ( 4 ) relative to a plane defined by the base plate ( 11 ).

1 . A heat spreader for dissipating heat generated by at least one heat-generating power semiconductor device ( 2 ), the heat spreader ( 3 ) comprising:
 a base plate ( 11 ) which is connectable in a heat-conducting manner to the at least one power semiconductor device ( 2 );   at least one heat coupling element ( 4 ) which is connected in a heat conducting manner to the at least one power semiconductor device ( 2 ) on the one hand and to the base plate ( 11 ) on the other hand and comprises at least one elastic layer ( 5 ),   wherein the heat coupling element ( 4 ) comprises at least one holding element for mechanically fixing the heat coupling element ( 4 ) relative to a plane defined by the base plate ( 11 ).   
     
     
         2 . The heat spreader according to  claim 1 , wherein the at least one holding element is configured such that the elastic layer is deformable in a direction transverse to the plane defined by the base plate ( 11 ). 
     
     
         3 . The heat spreader according to  claim 1 , wherein the at least one holding element is formed by a press-in bolt ( 12 ). 
     
     
         4 . The heat spreader according to  claim 3 , wherein each heat coupling element ( 4 ) is held by two press-in bolts ( 12 ). 
     
     
         5 . The heat spreader according to  claim 4 , wherein at least one heat coupling element ( 4 ) has a respective rectangular base area and the two press-in bolts ( 12 ) are arranged in corners of the base area that are opposite each other. 
     
     
         6 . The heat spreader according to  claim 1 , wherein the heat coupling element ( 4 ) comprises at least one metal core ( 9 ) which is made from copper, aluminum or magnesium. 
     
     
         7 . The heat spreader according to  claim 1 , wherein the base plate ( 11 ) is made from a metal. 
     
     
         8 . The heat spreader according to  claim 1 , wherein the base plate ( 11 ) and/or the heat coupling element ( 4 ) is/are provided with a surface coating, preferably a nickel layer or an eloxal layer. 
     
     
         9 . The heat spreader according to  claim 1 , wherein a heat-conducting interlayer is provided for coupling the at least one power semiconductor device ( 2 ) to the heat coupling element. 
     
     
         10 . The heat spreader according to  claim 9 , wherein the interlayer comprises a latent-heat storage material ( 15 ). 
     
     
         11 . The heat spreader according to  claim 1 , wherein the base plate ( 11 ) is connectable to a heat sink ( 8 ) or to a heat-discharging surface structure.