Antimicrobial adhesive system

Abstract

An adhesive composition having dispersed therein a broad spectrum antimicrobial agent for use in medical applications, such as an adhesive for surgical drapes, wound dressings and tapes, is provided. The adhesive is composed of acrylic polymers, tackifiers and a preferred antimicrobial agent, diiodomethyl-p-tolylsulfone. The subject adhesive composition may be formulated as either an essentially solventless hot melt, or as a solvent based system wherein an emulsion of the antimicrobial agent and the removal of excess solvent is avoided.

1 . An adhesive composition having antimicrobial properties for skin contact applications comprising:
 a. an acrylic polymer; and,   b. an effective amount of diiodomethyl-p-tolylsulfone dispersed throughout said acrylic polymer.   
     
     
         2 . The adhesive composition of  claim 1  wherein said acrylic polymer comprises a mixture of acrylic resin solutions. 
     
     
         3 . The adhesive composition of  claim 2  wherein a concentration of diiodomethyl-p-tolylsulfone in said acrylic polymer is about 0.1% to about 2% by weight. 
     
     
         4 . The adhesive composition of  claim 3  wherein a concentration of diiodomethyl-p-tolylsulfone in said acrylic polymer is about 0.1% to about 1% by weight. 
     
     
         5 . The adhesive composition of  claim 4  wherein a concentration of diiodomethyl-p-tolylsulfone in said acrylic polymer is about 0.1% to about 0.5% by weight. 
     
     
         6 . The adhesive composition of  claim 2  wherein said mixture of acrylic resin solutions includes a non self-curing acrylic resin solution. 
     
     
         7 . The adhesive composition of  claim 6  wherein said mixture of acrylic resin solutions includes a self-curing acrylic resin solution. 
     
     
         8 . The adhesive composition of  claim 7  wherein a concentration of diiodomethyl-p-tolylsulfone in said acrylic polymer is about 0.1% to about 2% by weight. 
     
     
         9 . The adhesive composition of  claim 8  wherein a concentration of diiodomethyl-p-tolylsulfone in said acrylic polymer is about 0.1% to about 1% by weight. 
     
     
         10 . The adhesive composition of  claim 9  wherein a concentration of diiodomethyl-p-tolylsulfone in said acrylic polymer is about 0.1% to about 0.5% by weight. 
     
     
         11 . The adhesive composition of  claim 8  wherein said non self-curing acrylic resin solution comprises a majority of said mixture of acrylic resin solutions. 
     
     
         12 . The adhesive composition of  claim 11  wherein a weight based ratio of said non self-curing acrylic resin solution to said self-curing resin solution for said mixture of acrylic resin solutions is between about 7 and 10. 
     
     
         13 . The adhesive composition of  claim 12  wherein said non self-curing acrylic resin solution of said mixture of acrylic resin solutions comprises about 40-45 weight percent solids. 
     
     
         14 . The adhesive composition of  claim 13  wherein said self-curing acrylic resin solution of said mixture of acrylic resin solutions comprises about 30-35 weight percent solids. 
     
     
         15 - 16 . (canceled)