US2012080171A1PendingUtilityA1
Heat relay mechanism and heat-dissipating fin unit
Est. expirySep 30, 2030(~4.2 yrs left)· nominal 20-yr term from priority
H10W 40/73H05K 7/20336F28D 15/0233
37
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Claims
Abstract
A heat relay mechanism includes a heat-dissipating member for dissipating heat, a buffer member contacted with the heat-dissipating member at a first surface, a thermally deformable member connected to a second surface of the buffer member and deforms at a high temperature, a heat pipe connected to the thermally deformable member at one end, and a device connected to another end of the heat pipe.
Claims
exact text as granted — not AI-modified1 . A heat relay mechanism comprising:
a heat-dissipating member for dissipating heat; a buffer member contacted with the heat-dissipating member at a first surface; a thermally deformable member connected to a second surface of the buffer member and deforms at a high temperature; a heat pipe connected to the thermally deformable member at one end; and a device connected to another end of the heat pipe.
2 . The heat relay mechanism according to claim 1 , wherein the thermally deformable member is a plate-like member that deforms with a rise of temperature in such a manner as to bend toward one side.
3 . The heat relay mechanism according to claim 1 , wherein the buffer member is a thermal sheet in which silicon rubber is provided, the buffer member being provided with a thin metal film on the first surface thereof.
4 . The heat relay mechanism according to claim 1 , wherein the heat-dissipating member is a second heat pipe and conducts heat of a heat-generating element.
5 . The heat relay mechanism according to claim 1 , wherein the thermally deformable member is a bimetal or trimetal member in which plate-like metal members having different coefficients of thermal expansion are bonded together.
6 . A heat-dissipating fin unit comprising:
a first heat pipe; a buffer member contacted with the first heat pipe at a first face; a thermally deformable member connected to a second surface of the buffer member and deforms at a high temperature; and a second heat pipe connected to the thermally deformable member at one end.Join the waitlist — get patent alerts
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