Unit for removing foreign matter and apparatus and method for semiconductor packaging using the same

Abstract

An example embodiment relates to a foreign matter removing unit including a body, an injection member, and a suction member. The injection member includes a portion of the body defining at least one injection hole. The suction member includes a part of the body defining at least one suction hole. The injection member of the foreign matter removing unit is configured to inject gas into a suction region in which the suction member is configured to exert a suction force.

1 . A foreign matter removing unit comprising:
 a body;   an injection member including one of (i) a portion of the body defining at least one injection hole and (ii) a tubular member defining at least one injection hole, the injection member configured to inject at least gas onto an object; and   a suction member including a part of the body defining at least one suction hole,   the suction member configured to suck at least foreign matter scattered from the object by the injected gas, and   the suction member configured to exert a suction force in a suction region of the object where the injection member is configured to inject gas.   
     
     
         2 . The foreign matter removing unit of  claim 1 , wherein
 the injection member includes the portion of the body defining at least one injection hole,   the foreign matter removing unit further includes at least one magnet member on a bottom surface of the body facing the object, and   the at least one magnet member is disposed closer to the at least one suction hole than the at least one injection hole on the bottom surface of the body.   
     
     
         3 . The foreign matter removing unit of  claim 1 , wherein
 the injection member includes the portion of the body and the portion of body defines at least two injection holes, and   the at least one suction hole is disposed in between the at least two injection holes on a bottom surface of the body.   
     
     
         4 . The foreign matter removing unit of  claim 1 , wherein
 the injection member includes the at least one tubular member, and   the at least one tubular member is configured inside the suction hole.   
     
     
         5 . The foreign matter removing unit of  claim 1 , wherein
 the injection member includes the tubular member,   the tubular member includes an injection nozzle,   the part of the body defines a plurality of first suction holes and a plurality of second suction holes, and   the first suction holes are a different size than the second suction holes.   
     
     
         6 . The foreign matter removing unit of  claim 1 , wherein
 the injection member includes the tubular member,   the tubular member is disposed parallel to the body, and   the tubular member defines a plurality of injection holes facing the object.   
     
     
         7 . The foreign matter removing unit of  claim 1 , wherein
 the part of the body defines at least one suction hole including a slit shape defined along a length direction of the body and on a surface of the body facing the object,   the injection member includes the portion of the body defining at least one injection hole,   the at least one injection hole is arranged in a line parallel to the at least one suction hole, and   the at least one injection hole is inclined toward the suction region.   
     
     
         8 . The foreign matter removing unit of  claim 1 , wherein
 the part of the body defines at least one suction hole including a slit shape defined along a length direction of the body and on a surface of the body facing the object,   the injection member includes the portion of the body,   the portion of the body defines at least one slit-shaped first injection hole and at least one slit-shaped second injection hole parallel to the suction hole,   the first injection hole is on one side of the suction hole,   the second injection hole is on an other side of the suction hole, and   the first injection hole and the second injection hole are inclined towards the suction region of the object.   
     
     
         9 . The foreign matter removing unit of  claim 1 , wherein
 the injection member includes the tubular member,   the tubular member is disposed perpendicular to the object,   the suction member includes an outer tube in which the tubular member of the injection member is inserted, and   the outer tube is configured to suck the foreign matter scattered from the object through a space provided between the outer tube and the tubular member.   
     
     
         10 . The foreign matter removing unit of  claim 1 , wherein
 the injection member and the suction member are disposed above the object to face each other with respect to the suction region,   the injection member includes the tubular member,   the tubular member includes an injection nozzle inclined toward the suction region,   and   the at least one suction hole is inclined toward the suction region in a surface of the body facing the object.   
     
     
         11 . The foreign matter removing unit of  claim 1 , wherein
 the suction member includes at least one slit-shaped suction hole longitudinally defined along a length direction of the body in a surface of the body facing the object,   the injection member includes the tubular member,   the tubular member is disposed parallel to the body on a side of the body, and   the tubular member defines a plurality of injection holes arranged in a length direction of the tubular member, and   the injection holes are inclined toward the suction region of the object in which the suction force of the suction hole acts.   
     
     
         12 . The foreign matter removing unit of  claim 1 , further comprising:
 a magnet member disposed on a bottom surface of the body, the magnet member applying a magnetic force to the foreign matter containing metal components scattered from the object by the gas injected onto the object.   
     
     
         13 . A semiconductor packaging device comprising:
 a process unit configured to perform a semiconductor packaging process; and   a foreign matter removing unit disposed in the process unit and configured to remove foreign matter remaining on an object, the foreign matter removing unit including,
 a body, 
 an injection member including one of (i) a portion of the body defining at least one injection hole and (ii) a tubular member defining at least one injection hole, the injection member configured to inject at least gas onto the object, and 
 a suction member including a part of the body defining at least one suction hole, the suction member configured to suck foreign matter scattered from the object by the injected gas, and 
 the suction member configured to exert a suction force in a suction region of the object where the injection member is configured to inject gas. 
   
     
     
         14 . The semiconductor packaging device of  claim 13 , wherein
 the object includes a wafer on which a back surface thereof is polished, and   the process unit includes,
 a wafer chuck on which the wafer is mounted to allow the polished back surface of the wafer to face an upper side, 
 a dicing tape attacher configured to attach a dicing tape on the back surface of the wafer mounted on the wafer chuck, and 
   the foreign matter removing unit is connected to the process unit and configured to move in a straight direction above the wafer chuck and configured to remove the foreign matter on the back surface of the wafer mounted on the wafer chuck.   
     
     
         15 . The semiconductor packaging device of  claim 13 , wherein
 the injection member and the suction member are disposed above the wafer chuck,   the part of the body defines at least one suction hole including a slit shape along a length direction of the body and on a bottom surface of the body,   the injection member includes the portion of the body defining at least one injection hole,   the at least one injection hole is arranged in a line parallel to the at least one suction hole, and   the at least one injection hole is inclined toward the suction region of the back surface of the wafer in which the suction force of the suction hole acts.   
     
     
         16 . The semiconductor packaging device of  claim 13 , wherein
 the object includes semiconductor chips separated into an individual unit and a wiring substrate to which the semiconductor chips are attached,   the process unit includes,
 a guide rail configured to support the wiring substrate; 
 a transfer member configured to transfer the wiring substrate along the guide rail; 
 a tape expander on which a wafer ring configured to maintain the semiconductor chips is disposed, the tape expander disposed at a side of the guide rail; and 
 a chip bonder configured to pick up the semiconductor chips maintained by the wafer ring to attach the semiconductor chips to the wiring substrate, and 
   the foreign matter removing unit is configured to remove the foreign matter remaining on the semiconductor chips and the wiring substrate.   
     
     
         17 . The semiconductor packaging device of  claim 16 , wherein
 the injection member and the suction member are disposed on a front end of the guide rail,   the part of the body defines at least one suction hole including a slit shape defined along a direction crossing the guide rail in a bottom surface of the body,   the injection member includes the portion of the body,   the portion of the body defines at least one slit-shaped first injection hole and at least one slit-shaped second injection hole parallel to the suction hole,   the first injection hole is on one side of the suction hole,   the second injection hole is on an other side of the suction hole, and   the first injection hole and the second injection hole are inclined toward the suction region of the wiring substrate.   
     
     
         18 . The semiconductor packaging device of  claim 16 , wherein
 the injection member and the suction member are movably connected to the guide rail,   the injection member and the suction member are configured to move horizontally above a standby position of the wiring substrate between a front end and a rear end of the guide rail,   the injection member includes the tubular member,   the tubular member is disposed perpendicular to the wiring substrate,   the suction member includes an outer tube in which the tubular member of the injection member is inserted, and   the outer tube is configured to suck the foreign matter scattered from the wiring substrate through a space provided between the outer tube and the tubular member.   
     
     
         19 . The semiconductor packaging device of  claim 16 , wherein
 the injection member and the suction member are disposed face each other above the semiconductor chips maintained by the wafer ring,   the injection member includes the tubular member,   the tubular member includes an injection nozzle inclined toward the semiconductor chips to be picked up by the chip bonder, and   the suction holes are inclined toward the semiconductor chips in a bottom surface of the suction body.   
     
     
         20 . The semiconductor packaging device of  claim 13 , wherein
 the object includes a wiring substrate on which semiconductor chips are attached,   the process unit includes:
 a guide rail configured to support the wiring substrate; 
 a transfer member configured to transfer the wiring substrate along the guide rail; and 
 a wire bonder configured to electrically connect the semiconductor chips to terminals of the wiring substrate, 
   the body and the at least one section hole extend longitudinally in a direction crossing the guide rail,   the injection member includes the tubular member,   the tubular member is disposed parallel to the body on a side of the body,   the tubular member defines a plurality of injection holes arranged in a length direction of the tubular member, and   the injection holes are inclined toward the suction region of the wiring substrate in which a suction force of the suction hole acts.