Heat dissipation device with multiple heat conducting pipes

Abstract

A heat dissipation device with multiple heat conducting pipes is mounted on a heat-generating element disposed on a carrier. The heat dissipation device includes a heat dissipation base having at least one heat dissipation body, and a plurality of heat conducting pipes which are connected to the heat dissipation body and protrude outwards. The heat conducting pipes are used to dissipate the heat generated by the heat-generating element via heat conduction and natural convection with air, thus having a double heat dissipation effect.

1 . A heat dissipation device mounted above a heat-generating element disposed on a carrier, the heat dissipation device comprising:
 a heat dissipation base having at least one heat dissipation body; and   a plurality of heat conducting pipes which are connected to the heat dissipation body and protrude outwards from the heat dissipation body.   
     
     
         2 . The heat dissipation device as claimed in  claim 1 , wherein the heat conducting pipes are monolithically formed on the at least one heat dissipation body. 
     
     
         3 . The heat dissipation device as claimed in  claim 1 , wherein there are a plurality of heat conductive cavities formed in the at least one heat dissipation body, and the heat conducting pipes are disposed in the heat conductive cavities respectively. 
     
     
         4 . The heat dissipation device as claimed in  claim 2 , wherein the heat dissipation base is a hollow rectangular base with four wall-shaped heat dissipation bodies which are mutually connected, and the heat conducting pipes are monolithically formed on the wall-shaped heat dissipation bodies and protrude outwards from four respective sides of the wall-shaped heat dissipation bodies. 
     
     
         5 . The heat dissipation device as claimed in  claim 3 , wherein the heat dissipation base is a hollow rectangular base with four wall-shaped heat dissipation bodies which are mutually connected, and the heat conductive cavities are formed in the wall-shaped heat dissipation bodies, and the heat conducting pipes are disposed in the heat conductive cavities respectively and protrude outwards from four respective sides of the wall-shaped heat dissipation bodies. 
     
     
         6 . The heat dissipation device as claimed in  claim 2 , wherein the heat dissipation base is a U-shaped heat dissipation base with two wall-shaped heat dissipation bodies which are opposite to each other, and the heat conducting pipes are monolithically formed on the wall-shaped heat dissipation bodies and protrude outwards from two respective sides of the wall-shaped heat dissipation bodies. 
     
     
         7 . The heat dissipation device as claimed in  claim 3 , wherein the heat dissipation base is a U-shaped heat dissipation base with two wall-shaped heat dissipation bodies which are opposite to each other, and the heat conductive cavities are formed in the wall-shaped heat dissipation bodies, and the heat conducting pipes are disposed in the heat conductive cavities respectively and protrude outwards from two respective sides of the wall-shaped heat dissipation bodies. 
     
     
         8 . The heat dissipation device as claimed in  claim 2 , wherein the heat dissipation base is a block-shaped heat dissipation base with a block-shaped heat dissipation body, and the heat conducting pipes are monolithically formed on the wall-shaped heat dissipation bodies and protrude outwards from two opposite sides of the block-shaped heat dissipation body respectively. 
     
     
         9 . The heat dissipation device as claimed in  claim 3 , wherein the heat dissipation base is a block-shaped heat dissipation base with a block-shaped heat dissipation body, and the heat conductive cavities are formed in the block-shaped heat dissipation body, and the heat conducting pipes are disposed in the heat conductive cavities respectively and protrude outwards from two opposite sides of the block-shaped heat dissipation body respectively. 
     
     
         10 . The heat dissipation device as claimed in  claim 2 , wherein the heat dissipation base is a disk-shaped heat dissipation base with a disk-shaped heat dissipation body, and the heat conducting pipes are monolithically arranged in an arrangement of at least one circle on the disk-shaped heat dissipation body, and the heat conducting pipes protrude upwards from the disk-shaped heat dissipation body respectively. 
     
     
         11 . The heat dissipation device as claimed in  claim 3 , wherein the heat dissipation base is a disk-shaped heat dissipation base with a disk-shaped heat dissipation body, and the heat conductive cavities are formed in an arrangement of at least one circle on the disk-shaped heat dissipation body, and the heat conducting pipes are disposed in the heat conductive cavities, and the heat conducting pipes protrude upwards from the disk-shaped heat dissipation body respectively. 
     
     
         12 . The heat dissipation device as claimed in  claim 1 , wherein each of the heat conducting pipes has a plurality of axial grooves formed in its interior wall.