Plating apparatus and plating method

Abstract

A plating apparatus includes a plating bath configured to perform plating processing of a substrate with a plating solution including an inorganic constituent and an organic constituent introduced into the plating bath, a chemical supplying unit configured to supply each chemical of the inorganic constituent and the organic constituent, an electrode configured to dispose in the plating solution and the electrode configured to selectively adsorb a by-product produced from the organic constituent, and an electric current applying unit configured to apply a predetermined electric current to the electrode.

What is claimed is: 
     
         1 . A plating apparatus, comprising:
 a plating bath configured to perform plating processing of a substrate with a plating solution including an inorganic constituent and an organic constituent introduced into the plating bath;   a chemical supplying unit configured to supply each chemical of the inorganic constituent and the organic constituent;   an electrode configured to dispose in the plating solution and the electrode configured to selectively adsorb a by-product produced from the organic constituent; and   an electric current applying unit configured to apply a predetermined electric current to the electrodes.   
     
     
         2 . The plating apparatus according to  claim 1 , further comprising:
 a plating solution tank into which the chemical is supplied from the chemical supplying unit;   a plating solution circulating line provided between the plating bath and the plating solution tank; and   a by-product adsorbing unit provided along the plating solution circulating line, the electrodes are disposed in the by-product adsorbing unit.   
     
     
         3 . The plating apparatus according to  claim 1 , further comprising a rotation controlling unit that rotates the electrode. 
     
     
         4 . The plating apparatus according to  claim 1 , wherein the electrode have a concavo-convex shape on their surfaces. 
     
     
         5 . The plating apparatus according to  claim 1 , wherein the electrode is one of a pair of plate electrodes made up of opposed negative and positive electrodes. 
     
     
         6 . The plating apparatus according to  claim 5 , wherein the negative electrode is rotatable. 
     
     
         7 . The plating apparatus according to  claim 5 , wherein the negative electrode has a concavo-convex surface. 
     
     
         8 . The plating apparatus according to  claim 7 , wherein the organic constituent includes an accelerator, a suppressor, and a leveler, and the leveler is a nitrogen-containing organic compound. 
     
     
         9 . The plating apparatus according to  claim 1 , wherein the electric current applying unit applies the electric current to the electrode continuously or at a predetermined interval. 
     
     
         10 . A plating method, comprising:
 preparing a plating solution to be predetermined concentrations of an inorganic constituent and an organic constituent in the plating solution respectively;   immersing a substrate in the plating solution and performing plating processing; and   applying a predetermined electric current to electrode provided in the plating solution and selectively adsorbing the by-product produced from the organic constituent onto the electrode.   
     
     
         11 . The plating method according to  claim 10 , further comprising circulating the plating solution through a plating solution circulating line, the electrodes are provided along the plating solution circulating line. 
     
     
         12 . The plating method according to  claim 10 , wherein the organic constituent includes an accelerator, a suppressor, and a leveler, and the by-product of the leveler is selectively adsorbed onto the electrodes. 
     
     
         13 . The plating method according to  claim 10 , wherein the leveler is a nitrogen-containing organic compound. 
     
     
         14 . The plating method according to  claim 10 , wherein the predetermined electric current is lower than an embedded electroplating current applied when the plating processing is performed. 
     
     
         15 . The plating method according to  claim 10 , wherein the predetermined electric current is 1 to 10 mA/cm 2 . 
     
     
         16 . The plating method according to  claim 10 , wherein the electric current is applied continuously or at a predetermined interval. 
     
     
         17 . The plating method according to  claim 10 , wherein the electric current is applied while rotating the electrode. 
     
     
         18 . The plating method according to  claim 17 , wherein the electrode is one of a pair of plate electrodes made up of opposed negative and positive electrodes, and at least the negative electrode is rotated. 
     
     
         19 . The plating method according to  claim 10 , wherein the electrode has a concavo-convex surface and adsorb the by-product intensively on a shoulder of the concave. 
     
     
         20 . The plating method according to  claim 19 , wherein the electrode is one of a pair of plate electrodes made up of opposed negative and positive electrodes, and at least the negative electrode has the concavo-convex surface.