Nickel electroplating solution and chip parts using the same

Abstract

Disclosed herein is a nickel electroplating solution and chip parts using the same, and more particularly, to a nickel electroplating solution including: nickel metal; nickel chloride; boric acid; a first additive of at least one selected from a group consisting of benzene, naphthalene, xylene, sulfonic acid, sodium sulfonate, and saccharine (C 7 H 5 NO 3 S); and a second additive of at least one selected from a group consisting of sodium dialkyl sulfosuccinate, sodium lauryl sulfate, polyethylene glycol, polyethylene glycol methylether, and polyethylene glycol lauryl amineether to have excellent smoothness and wettability, thereby forming a nickel electroplating layer which is uniform and smooth and has no unplated part and improve soldering characteristics regardless of the surface state and structural shape of an external terminal electrode which is a plated article, and chip parts using the same.

1 . A nickel electroplating solution, including:
 nickel metal;   nickel chloride;   boric acid;   a first additive of at least one selected from a group consisting of benzene, naphthalene, xylene, sulfonic acid, sodium sulfonate, and saccharine (C 7 H 5 NO 3 S); and   a second additive of at least one selected from a group consisting of sodium dialkyl sulfosuccinate, sodium lauryl sulfate, polyethylene glycol, polyethylene glycol methylether, and polyethylene glycol lauryl amineether.   
     
     
         2 . The nickel electroplating solution of  claim 1 , wherein sodium dialkyl sulfosuccinate is selected from a group consisting of sodium diisobutyl sulfosuccinate, sodium dihexyl sulfosuccinate, sodium dicyclohexyl sulfosuccinate, and sodium dioctyl sulfosuccinate. 
     
     
         3 . The nickel electroplating solution of  claim 1 , wherein the first additive is included with 5 to 30 g/L. 
     
     
         4 . The nickel electroplating solution of  claim 3 , wherein the first additive is included with 10 to 20 g/L. 
     
     
         5 . The nickel electroplating solution of  claim 1 , wherein the second additive is included with 0.5 to 5 g/L. 
     
     
         6 . A chip part including a nickel plated layer formed by using a nickel electroplating solution of  claim 1  as a barrier layer.