Method of fabricating microelectromechanical systems devices

Abstract

A method of fabricating microelectromechanical systems devices is disclosed. A silicon substrate having a plurality of microelectromechanical systems elements formed on a first surface thereof is provided. A guard layer defining a plurality of recesses is applied to the silicon substrate such that respective microelectromechanical systems elements are located within respective recesses. The silicon substrate is then segmented into discrete parts and an adhesive layer is bonded to a second surface of the silicon substrate. The guard layer is next segmented into discrete parts corresponding to the discrete parts of the silicon substrate, thereby forming individual microelectromechanical systems devices. Finally, the adhesive layer is selectively exposed to a light source allowing removal of individual microelectromechanical systems devices.

1 . A method of fabricating microelectromechanical systems devices, the method comprising the steps of:
 forming a plurality of microelectromechanical systems elements on a first surface of a silicon substrate;   applying a guard layer to the first surface of the silicon substrate, the guard layer defining a plurality of recesses and respective microelectromechanical systems elements are received within respective recesses;   segmenting the silicon substrate into discrete parts, each discrete part including at least one microelectromechanical systems element;   bonding an adhesive layer to a second surface of the silicon substrate, the second surface being opposite said first surface;   segmenting the guard layer corresponding to the discrete parts of the silicon substrate thereby forming individual microelectromechanical systems devices; and   selectively exposing the adhesive layer to a light source allowing removal of individual microelectromechanical systems devices.   
     
     
         2 . A method as claimed in  claim 1 , wherein said light source is an ultraviolet light source. 
     
     
         3 . A method as claimed in  claim 1 , wherein said light source exposes said adhesive layer through a mask. 
     
     
         4 . A method as claimed in  claim 1 , further comprising the step of applying a handling layer to the adhesive layer so that the adhesive layer is located between the handling layer and the substrate, said handling layer being at least partially transparent. 
     
     
         5 . A method as claimed in  claim 1 , wherein said microelectromechanical systems devices are printheads and said microelectromechanical systems elements are ink ejection nozzles, said method comprising the further step of etching a plurality of ink supply channels in the second surface of the silicon substrate prior to bonding the adhesive layer to the second surface. 
     
     
         6 . A method as claimed in  claim 5 , comprising the further step of etching a plurality of ink ejection channels in the guard layer so that each ink ejection channel is in register with respective ink ejection nozzles.