Method and device for the electrolytic treatment of high-resistance layers

Abstract

A method and a device for electroplating and electrolytically etching plate-shaped or strip-shaped material in continuous installations or bath installations having rotating transport and contact structures along the conveyor belt. The current is fed to the material in the center, i.e. in the useful zone, thereby obtaining a layer thickness distribution which is at least as good as when the current is supplied from both edges. The invention further allows material of any formats of width and different contours to be electrolytically treated in any order.

1 . A method for the electroplating or electrolytic etching of plate-shaped or strip-shaped material ( 1 ) in continuously operating plant or strip plant for passing material from one roll to the next, having transport and contact means ( 2 ) along a transport path,
 characterised in that the material is supplied with the electrolytic current by means of contacts ( 3 ) on the transport and contact means ( 2 ) by way of at least one contact track ( 15 ) which runs inside the useful area ( 17 ) of the material ( 1 ).   
     
     
         2 . A method according to  claim 1 , characterised in that electrical contact is made and the electrolytic current is supplied to the material transversely to the direction of transport, in the centre zone thereof. 
     
     
         3 . A method according to either of  claims 1  and  2 , characterised in that material ( 1 ) having different contours and/or different dimensions is brought into electrical contact in any desired sequence in the continuously operating plant as a result of the electrical contact made by means of at least one contact track ( 15 ) inside the useful area ( 17 ). 
     
     
         4 . A method according to one of  claims 1  to  3 , characterised in that with structural electroplating or structural etching the electrolytic current is supplied by way of at least one resist-free contact track ( 15 ). 
     
     
         5 . A method according to one of  claims 1  to  4 , characterised in that the electrolytic current is supplied by way of at least one contact track ( 15 ) which is kept free within the layout of end products ( 14 ) on the material or by way of at least one contact track ( 15 ) which extends over the end products ( 14 ) in the layout of the material. 
     
     
         6 . A method according to one of  claims 1  to  5 , characterised in that an individual rectifier ( 8 ) associated with each contact ( 3 ) supplies it with electrolytic current, or a common rectifier ( 8 ) supplies a plurality of contacts ( 3 ) with electrolytic current. 
     
     
         7 . A device for the electroplating or electrolytic etching of plate-shaped or strip-shaped material in continuously operating plant or strip plant, having transport and contact means ( 2 ) along the transport path, using the method according to  claim 1 ,
 characterised in that, transversely as seen in the direction of transport, the position of the at least one contact ( 3 ) on each transport and contact means ( 2 ) and the at least one corresponding contact track ( 15 ) on the material ( 1 ) are located inside the useful area ( 17 ) of the material ( 1 ).   
     
     
         8 . A device according to  claim 7 , characterised in that, transversely as seen in the direction of transport, the position of the contact ( 3 ) on each transport and contact means ( 2 ) and the corresponding contact track ( 15 ) on the material ( 1 ) are located approximately or precisely in the centre of the transport path. 
     
     
         9 . A device according to either of  claims 7  and  8 , characterised in that the usable zone of the material ( 1 ) for the end products ( 14 ) is also located in the zone of the contact track(s) ( 15 ).