Method for construction, strengthening and homogenization of a wafer

Abstract

The present invention provides a method for strengthening, homogenization and construction of a wafer. The concave and convex portions are processed by laser or etching, and then formed at intervals on the grinding surface of the wafer. The concave and convex portions are round or polygonal shapes. With the alternated arrangement of the concave and convex portions, a mesh structure of consistent construction is formed on the grinding surface of the wafer, making it possible to cut down greatly the interference and influence generated by the texture of grinding surface, and improve substantially the structural strength of the grinding surface for a consistent quality of wafer with better applicability and industrial benefits.

I claim: 
     
         1 . A method for strengthening and homogenization of a wafer, comprising the steps of:
 cutting to form a flaky wafer with a grinding surface;   processing and shaping concave and convex on portions of said grinding surface at intervals, said grinding surface of the wafer having levelness set by the portions.   
     
     
         2 . The method defined in  claim 1 , wherein the step of processing is implemented by laser. 
     
     
         3 . The method defined in  claim 1 , wherein the step of processing is implemented by etching. 
     
     
         4 . The method defined in  claim 1 , wherein the step of processing and shaping the concave and convex portions is further comprised of cutting off. 
     
     
         5 . The method defined in  claim 1 , wherein the step of cutting to form the wafer is before the step of processing and shaping concave and convex portions. 
     
     
         6 . The method defined in  claim 1 , wherein the step of processing and shaping the concave and convex portions is in a mesh shape.