Dopo derivative flame retardants

Abstract

The present invention relates to novel, halogen-free flame retardant derived from 9,10-Dihydro-9-Oxa-10-Phosphaphenantrene-10-oxide (DOPO). This invention also relates to the use of the halogen free DOPO derived flame retardant in polymers.

1 . A compound having the following structure: 
       
         
           
           
               
               
           
         
       
     
     
         2 . The compound of  claim 1 , which is substantially free of an organic base. 
     
     
         3 - 8 . (canceled) 
     
     
         9 . The compound of  claim 1 , wherein the d 50  particle size is less than about 15 microns. 
     
     
         10 . A flame retardant polymer composition comprising a polymer and the compound of  claim 1 . 
     
     
         11 . The composition of  claim 10 , wherein said polymer is polyolefins, polyesters, polyethers, polyketones, polyamides, polyvinylchlorides, natural and synthetic rubbers, polyurethanes, polystyrenes, poly(meth)acrylates, phenolic resins, polybenzoxazine, polyacetals, polyacrylonitriles, polybutadienes, polystyrenes, polyimides, polyamideimides, polyetherimides, polyphenylsulfides, polyphenylene oxide, polycarbonates, cellulose, cellulose derivatives, cyanate esters, polyphenylene esters, polybutadiene resins, butadiene-styrene resins, butadiene-divinylbenzene-styrene resins, epoxy-modified polybutadiene resins, acrylic or vinyl acetate adhesives, carboxyl-terminated butadiene-acrylonitrile copolymers, phenylene ethers, maleic anhydride-grafted butadiene-styrene copolymers, maleic anhydride-modified 4-methyl-1pentene resins, maleated 1-butene-ethylene copolymers, resins derived from vinylbenzyl ether compounds, epoxy resins or mixtures thereof. 
     
     
         12 . (canceled) 
     
     
         13 . The composition of  claim 10 , wherein said polymer is polyesters or polyamides. 
     
     
         14 . The composition of  claim 10 , wherein said polymer is a phenolic resin or an epoxy resin, and wherein said composition further contains a curing or polymer initiation agent. 
     
     
         15 . A prepreg or laminate comprising an organic or inorganic reinforcing material and the composition of  claim 14 . 
     
     
         16 . (canceled) 
     
     
         17 . The composition of  claim 10 , wherein the organic phosphorous content of the composition is about 0.1 wt % to about 10 wt %, based on the total weight of the composition. 
     
     
         18 . (canceled) 
     
     
         19 . The composition of  claim 10 , further comprising a melamine polyphosphate. 
     
     
         20 . The composition of  claim 10 , further comprising silica. 
     
     
         21 . A process for preparing the compound of Formula I: 
       
         
           
           
               
               
           
         
       
       comprising reacting a compound of Formula A 
       
         
           
           
               
               
           
         
       
       with dihaloethane in the presence of a base. 
     
     
         22 . The process of  claim 21 , wherein said base is potassium methoxide, sodium methoxide, lithium methoxide, potassium ethoxide, sodium ethoxide, lithium ethoxide, potassium t-butoxide, sodium t-butoxide, lithium diisopropyl amide or mixtures thereof.