Replaceable cover for membrane carrier

Abstract

A replaceable cover secured to the surface of a membrane positioned on a wafer carrier.

What is claimed is: 
     
         1 . An object carrier used in a polishing device comprising:
 a housing;   a retaining ring characterized by an inner diameter coupled to the housing, said retaining ring sized and dimensioned to receive the object;   a membrane having a first surface and extending across a bottom surface of a support member within the object housing, said membrane disposed within the inner diameter of said retaining ring; and   a first cover secured to said first surface of said membrane to protect the membrane from damage.   
     
     
         2 . The carrier of  claim 1  wherein said first cover is removed from said membrane and replaced with a second cover. 
     
     
         3 . The carrier of  claim 1  wherein said object comprises a wafer. 
     
     
         4 . The carrier of  claim 1  wherein said protective cover comprises first and second surfaces, said first surface having an adhesive layer formed thereon. 
     
     
         5 . The carrier of  claim 4  wherein said protective cover is made from an elastomer. 
     
     
         6 . The carrier of  claim 1  wherein said protective cover is circular in shape. 
     
     
         7 . The carrier of  claim 6  wherein the diameter of said protective cover is in the range between 100 mm and 450 mm. 
     
     
         8 . The carrier of  claim 6  wherein the thickness of said protective cover is in the range between 1/64 inches and ⅛ inches. 
     
     
         9 . A method for polishing the surface of an object comprising:
 providing an object carrier, the carrier comprising a housing, a retaining ring characterized by an inner diameter and coupled to the housing;   inserting a membrane having first and second surfaces, said first surface of said membrane extending across a bottom surface of a support member in the object carrier, within the inner diameter of the retaining ring; and   providing a first member having first and second surfaces, said first surface covering said second surface of said membrane thereby protecting said membrane from damage.   
     
     
         10 . The method of  claim 9  wherein said first surface of said protective cover has an adhesive layer formed thereon. 
     
     
         11 . The method of  claim 9  further including the step of inflating said membrane in the object carrier to apply downward force to said object. 
     
     
         12 . The method of  claim 9  further including the step of removing said first protective cover from said membrane and replacing it with a second protective cover. 
     
     
         13 . The method of  claim 9  wherein said object comprises a wafer to be polished.