Electronics substrate with enhanced direct bonded metal

Abstract

A substrate for electronic components includes a ceramic tile and a cooling metal layer. The cooling metal layer can include copper, aluminum, nickel, gold, or other metals. The cooling metal layer has an enhanced surface facing away from the ceramic tile, where the enhanced surface includes either fins or pins. Electronic components can be connected to the substrate on a surface opposite the cooling metal layer.

1 . An electronics substrate comprising:
 a ceramic tile having an electronics face opposite a cooling face;   a cooling metal layer directly bonded to the cooling face, where the cooling metal layer comprises a monolithic enhanced surface; and   an electronic metal layer directly bonded to the electronics face;   
     
     
         2 . The substrate of  claim 1  where the enhanced surface comprises a plurality of fins separated by channels. 
     
     
         3 . The substrate of  claim 2  where the cooling metal layer has a cooling metal layer outer surface, and the fins extend beyond the cooling metal layer outer surface. 
     
     
         4 . The substrate of  claim 1  where the enhanced surface comprises a plurality of pins. 
     
     
         5 . The substrate of  claim 4  where the cooling metal layer has a cooling metal layer outer surface, and the pins extend beyond the cooling metal layer outer surface. 
     
     
         6 . The substrate of  claim 1  where the ceramic tile consists of a material selected from aluminum oxide, aluminum nitride, beryllium oxide, or any combination thereof. 
     
     
         7 . The substrate of  claim 1  further comprising a tub connected to the cooling metal layer over the monolithic enhanced surface such that a chamber is formed between the tub and the cooling metal layer, and the enhanced surface is positioned within the chamber. 
     
     
         8 . The substrate of  claim 7  further comprising a coolant inlet and a coolant outlet penetrating the chamber. 
     
     
         9 . The substrate of  claim 1  further comprising an electronic component mounted to the electronic metal layer. 
     
     
         10 . The substrate of  claim 1  where the cooling metal layer has a thickness between 0.2 millimeters and 0.5 millimeters. 
     
     
         11 . The substrate of  claim 1  where the cooling metal layer comprises a plurality of monolithic enhanced surfaces. 
     
     
         12 . A method of producing an electronics substrate comprising:
 (a) providing a ceramic tile with a cooling metal layer and an electronic metal layer directly bonded to opposite sides of the ceramic tile, and where the cooling metal layer has a cooling metal layer thickness   (b) securing the substrate to a machining base;   (c) cutting fins into the cooling metal layer with a tool after step (a) to form an enhanced surface, where the tool cuts into the cooling metal layer to a depth less than the cooling metal layer thickness;   
     
     
         13 . The method of  claim 12  further comprising:
 (d) connecting a tub to the cooling metal layer such that a chamber is formed between the tub and the cooling metal layer, and where enhanced surface is positioned in the chamber. 
 
     
     
         14 . The method of  claim 13  further comprising:
 (e) forming a coolant inlet and a coolant outlet that penetrate the chamber; 
 
     
     
         15 . The method of  claim 12  further comprising:
 connecting an electronic component to the electronic metal layer 
 
     
     
         16 . The method of  claim 12  where step (c) further comprises forming the fins to a fin height extending beyond a cooling metal layer outer surface. 
     
     
         17 . The method of  claim 12  further comprising slicing across the fins to form pins which extend beyond a cooling metal layer outer surface. 
     
     
         18 . The method of  claim 12  where the ceramic tile consists of aluminum oxide, aluminum nitride, beryllium oxide, or any combination thereof. 
     
     
         19 . The method of  claim 12  where the cooling metal layer thickness is between 0.2 and 0.5 millimeters. 
     
     
         20 . An electronics substrate comprising:
 an insulating material having an electronics face opposite a cooling face;   a cooling metal layer directly bonded to the cooling face, where the cooling metal layer comprises a monolithic enhanced surface;   an electronic metal layer directly bonded to the electronics face; and   means for passing a coolant directly over the enhanced surface while protecting the electronic metal layer from direct contact with the coolant.   
     
     
         21 . The electronics substrate of  claim 20  where the insulating material is a ceramic tile.