US2012024579A1PendingUtilityA1

Bendable circuit structure for led mounting and interconnection

54
Individually held — no corporate assignee on recordPriority: Dec 4, 2007Filed: Oct 7, 2011Published: Feb 2, 2012
Est. expiryDec 4, 2027(~1.3 yrs left)· nominal 20-yr term from priority
Inventors:Daniel Irwin Amey, Jr.Deborah R. GravelyMichael J. GreenSteven H. White
H05K 1/056H05K 3/386Y10T29/49124Y10T428/12569H05K 3/22H05K 2203/302Y10T29/49117Y10T29/49126Y10T29/49002Y10T428/24975H05K 1/189H05K 1/028Y10T29/49147H05K 2203/0315Y10T428/24F21V 21/00H05K 2201/10106H05K 2201/0154Y10T428/31681H05K 2201/0209H05K 1/0271Y10T29/49144Y10T428/31678
54
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

This invention is directed to bendable circuit substrate structures useful for LED mounting and interconnection.

Claims

exact text as granted — not AI-modified
1 - 16 . (canceled) 
     
     
         17 . A method of manufacturing a light emitting diode (“LED”) lighting composition, comprising:
 bending a circuit structure for LED mounting to a 90° or greater angle, the circuit structure for LED mounting comprising the following layers:
 (a) circuitry traces of copper or aluminum; 
 (b) a polyimide or adhesive layer, the metal layer being adjacent to the polymide or the adhesive layer 
 (c) a copper foil layer and 
 (d) a liquid or film solder mask layer 
 
 
       wherein the circuit structure for LED mounting has an increase in electrical resistance of less than 10% after bending.

Join the waitlist — get patent alerts

Track US2012024579A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.