Anti-static wrapper for electronic component wrapping, coated with nano film and manufacturing method thereof

Abstract

The invention is upon anti-static wrapper; specifically upon a new technology to manufacture anti-static wrapper using new materials which is different from those manufacture by spreading a surfactant or metallic materials. The aim of this invention is to manufacture a new and semi-permanent anti-static wrapper with excellent electric dissipation and adhesion to polymer film by depositing DLC film on polymer film. This invention also supplies the magnetic enhancing ion gun (MEIG) depositing device and high productive Roll-to-Roll device in which DLC film can be deposited on polymer film.

1 - 10 . (canceled) 
     
     
         11 . An anti-static wrapper for electronic component wrapping in which DLC (Diamond like carbon) film is coated upon a polymer film made of either Polyimide, Polyethylene, Polyethyleneterephthalate or Polypropylene. 
     
     
         12 . The anti-static wrapper for electronic component wrapping according to  claim 11  in which the above DLC film is coated on both sides of the above polymer film. 
     
     
         13 . The anti-static wrapper for electronic component wrapping according to  claim 11  in which the above DLC film is doped by at least one of Al and W. 
     
     
         14 . The anti-static wrapper for electronic component wrapping according to  claim 11  comprising DLC film as a buffer layer on the polymer and further comprising metal film on the DLC film. 
     
     
         15 . The anti-static wrapper for electronic component wrapping according to  claim 14  comprising further DLC film on the metal film. 
     
     
         16 . The anti-static wrapper for electronic component wrapping according to  claim 11  in which polymer film is coated by stacking DLC film and metal film repeatedly in aforesaid sequence, and the final coating is made by DLC such that the entire multi-layer thickness is 3 to 100 nm. 
     
     
         17 . A method for manufacturing anti-static wrapper for electronic component wrapping that comprises:
 a step to put polymer film in the reaction chamber;   a step to vacuumize inside the reaction chamber in 10-3 or 10-7 torr; and   a step to deposit DLC film on the said polymer film:   wherein the said DLC depositing step employs magnetic enhanced ion gun depositing device including anode, cathode generating magnetic field, linear ion source with gas feed means and Roll-to-Roll device; and   proceeds continuous deposition of DLC film on the said polymer film rolled on the Roll-to-Roll device by operating the 1st roller and the 2nd roller of the Roll-to-Roll device such that the thickness of the deposited DLC film ranges between 1 nm and 40 nm and anti-static wrapper for electronic component wrapping in which DLC film is deposited on polymer film, whose resistance ranges between 106 and 1010 Ω/sq.   
     
     
         18 . The method for manufacturing anti-static wrapper for electronic component wrapping according to  claim 17  wherein Roll-to-Roll device is used at a step of depositing the said DLC film, and DLC film is coated on both sides of the said polymer film rolled on the roller of Roll-to-Roll device. 
     
     
         19 . The method for manufacturing anti-static wrapper for electronic component wrapping according to  claim 18  wherein more than one gas among CH4, C2H2, C6H6, or C4H10 is supplied to the magnetic enhanced ion gun at the step of depositing the above DLC film, and 1000 to 2500 Volt is applied to the said ion gun. 
     
     
         20 . The method for manufacturing anti-static wrapper for electronic component wrapping according to  claim 19  wherein another step to deposit metal film using sputter method is further included after the step of depositing the DLC film.