Electronic component assembly having profiled encapsulated bonds

Abstract

An electronic component assembly is provided having an integrated circuit supported on a first mounting area such that a first surface of the integrated circuit contacts the first mounting area, electrical conductors supported on a second mounting area, and a series of wire bonds extending from contact pads on a second surface of the integrated circuit, opposite the first surface, to the electrical conductors. The first and second mounting areas are stepped relative to one another and the wire bonds are covered in a bead of encapsulant. The bead of encapsulant has a profiled surface that is flat and inclined relative to the second surface.

1 . An electronic component assembly comprising:
 an integrated circuit supported on a first mounting area such that a first surface of the integrated circuit contacts the first mounting area;   a plurality of electrical conductors supported on a second mounting area; and   a series of wire bonds extending from contact pads on a second surface of the integrated circuit, opposite the first surface, to the electrical conductors,   wherein the first and second mounting areas are stepped relative to one another and the wire bonds are covered in a bead of encapsulant, the bead of encapsulant having a profiled surface that is flat and inclined relative to the second surface.   
     
     
         2 . An assembly according to  claim 1  wherein the first mounting area is more than 100 microns higher than the second mounting area. 
     
     
         3 . An assembly according to  claim 1  wherein the electrical conductors terminate in a line of bond pads, the bond pads being more than 2 millimeters from the contacts pads of the integrated circuit. 
     
     
         4 . An assembly according to  claim 1  wherein the wire bonds are formed from wire with a diameter of less than 40 microns and extend less than 100 microns above the second surface of the integrated circuit. 
     
     
         5 . An assembly according to  claim 1  wherein the bead of encapsulant extends less than 200 microns above the second surface of the integrated circuit. 
     
     
         6 . An assembly according to  claim 1  wherein the encapsulant is an epoxy material having a viscosity greater than 700 cp when uncured. 
     
     
         7 . An assembly according to  claim 1  wherein the wire bonds are formed using aluminum wire. 
     
     
         8 . An assembly according to  claim 1  wherein the second surface of the integrated circuit has functional elements spaced less than 260 microns from the contacts pads. 
     
     
         9 . An assembly according to  claim 8  wherein the integrated circuit is an inkjet printhead integrated circuit and the functional elements are nozzles through which ink is ejected. 
     
     
         10 . An assembly according to  claim 9  wherein the assembly is configured to be mounted in a printer such that during use the nozzles are less than 100 microns from a paper path.