Cooling apparatus and heating apparatus

Abstract

The present invention provides a cooling apparatus capable of improving a cooling efficiency and realizing a high speed cooling process. The present invention also provides a heating apparatus capable of improving a heating efficiency of a substrate and heating the substrate at high speed. A cooling apparatus according to one embodiment of the present invention includes a chamber; a substrate carrier for holding a substrate 1 to be carried into a stop position in the chamber from a carry-in port of the chamber, and to be further carried out from a carry-out port of the chamber; a first cooling plate and a second cooling plate respectively provided on both sides of the substrate carrier carried in to the stop position in the chamber; a gas supply opening, provided in at least one of the first cooling plate and the second cooling plate, for supplying gas to the substrate, gas supply means for supplying gas to the gas supply opening and moving means for moving the first cooling plate and the second cooling plate so as to be close to the substrate carrier.

1 . A cooling apparatus, comprising:
 a chamber;   first cooling means provided in the chamber and configured to cool a substrate;   second cooling means provided opposite to the first cooling means in the chamber and configured to cool the substrate;   placement means configured to place a substrate holding section holding the substrate in a placement area between the first cooling means and the second cooling means;   a gas supply opening provided in at least one of the first cooling means and the second cooling means and configured to supply gas that contributes to cooling of the substrate;   gas supply means configured to supply the gas to the gas supply opening; and   moving means configured to move the first cooling means and the second cooling means so that the first cooling means and the second cooling means come close to the substrate holding section placed in the placement area.   
     
     
         2 . A cooling apparatus according to  claim 1 , further comprising:
 an enclosure mounted to at least one of a support section for supporting the first cooling means and a support section for supporting the second cooling means,   wherein the enclosure surrounds a cooling means supported by the support section to which the enclosure is mounted, and extends toward an opposing cooling means, and   the enclosure is opened so that the cooling means supported by the support member to which the enclosure is mounted, communicates with the opposing cooling means.   
     
     
         3 . A cooling apparatus according to  claim 1 , further comprising:
 a first enclosure provided around the first cooling means so as to surround at least a part of a space between the first cooling means and the second cooling means; and   a second enclosure provided around the second cooling means so as to surround at least a part of a space between the second cooling means and the first cooling means,   wherein the first enclosure and the second enclosure are configured such that a region between the first enclosure and the second enclosure form a Labyrinth shape when the first cooling means and the second cooling means come close to the substrate holding section placed in the placement area by the moving means.   
     
     
         4 . A cooling apparatus according to  claim 1 , further comprising:
 control means configured to control the moving means so as to move the first cooling means and the second cooling means toward the substrate holding section placed in the placement area, and to control the gas supply means so as to supply the gas to the gas supply opening.   
     
     
         5 . A cooling apparatus according to  claim 1 ,
 wherein each of the first cooling means and the second cooling means comprises a Peltier device.   
     
     
         6 . A cooling apparatus according to  claim 5 , further comprising:
 an air duct configured to introduce air that cools the Peltier device.   
     
     
         7 . A heating apparatus, comprising:
 a chamber;   first heating means provided in the chamber and configured to heat a substrate;   second heating means provided opposite to the first heating means in the chamber and configured to heat the substrate;   placement means configured to place a substrate holding member holding the substrate in a placement area between the first heating means and the second heating means;   a gas supply opening provided in at least one of the first heating means and the second heating means and configured to supply gas that contributes to heating of the substrate;   gas supply means configured to supply the gas to the gas supply opening; and   moving means configured to move the first heating means and the second heating means so that the first heating means and the second heating means come close to the substrate holding section placed in the placement area.