Molded beam for optoelectronic sensor chip substrate

Abstract

A substrate on which a plurality of epoxy over molded integrated circuit dies are formed includes a beam formed on the substrate for providing stiffness to the substrate. The beam includes structure having a cross-sectional shape, for example, substantially in the shape of a trapezoid, “T” or “L”, and may be formed on the top or bottom surface of the substrate.

1 . A substrate comprising:
 a substantially planar sheet having a top surface and a bottom surface;   a plurality of epoxy over molded integrated circuit dies formed on the top surface of the sheet, wherein the epoxy over molded integrated circuit dies are separated from each other by a portion of the top surface defining an open area of the sheet between each pair of the epoxy over molded integrated circuit dies; and   an epoxy formed beam molded on the bottom surface of the sheet, wherein the epoxy formed beam is formed only from the epoxy forming the epoxy over molded integrated circuit dies.   
     
     
         2 . The substrate of  claim 1  wherein the epoxy formed beam has a length and a width, wherein each of the epoxy over molded integrated circuit dies has a length and a width, and wherein the length of the epoxy formed beam is substantially parallel to the length of the epoxy over molded integrated circuit dies. 
     
     
         3 . The substrate of  claim 1  wherein the epoxy formed beam has a length and a width, wherein each of the epoxy over molded integrated circuit dies has a length and a width, and wherein the length of the epoxy formed beam is substantially identical to the length of the epoxy over molded integrated circuit dies. 
     
     
         4 . The substrate of  claim 1  wherein the epoxy formed beam has a length and a width, wherein each of the epoxy over molded integrated circuit dies has a length and a width, and wherein the length of the epoxy formed beam is greater than the length of the epoxy over molded integrated circuit dies. 
     
     
         5 . A process comprising:
 selecting a substantially planar sheet having a top surface and a bottom surface;   forming a plurality of epoxy over molded integrated circuit dies on the top surface of the sheet, wherein the forming separates the epoxy over molded integrated circuit dies from each other by a portion of the top surface defining an open area of the sheet between each pair of the epoxy over molded integrated circuit dies; and   molding an epoxy formed beam on the bottom surface of the sheet, wherein the epoxy formed beam is formed only from the epoxy forming the epoxy over molded integrated circuit dies.   
     
     
         6 . The process of  claim 5  wherein the epoxy formed beam is not formed simultaneously with the epoxy over molded integrated circuit dies.