Pattern processing method of a workpiece's surface

Abstract

A pattern processing method of a workpiece surface includes at least the following steps. A first anodized process is performed to a workpiece, wherein a surface of the workpiece includes at least one flat portion and at least one curved portion. A patterned film including a releasable substrate and an acid-base resistant ink layer disposed thereon is provided, wherein a surface of the releasable substrate on which the acid-base resistant ink layer is disposed faces the workpiece. A force is applied to an edge of the patterned film to adhere the patterned film the workpiece smoothly, so as to transfer a pattern of the acid-base resistant ink layer to the workpiece. The releasable substrate is removed. The workpiece is etched and the acid-base resistant ink layer is removed; and a second anodized process is performed to form a dichromatic anode three-dimensional texture.

1 . A pattern processing method of a workpiece surface, comprising:
 performing a first anodized process to a surface of a workpiece, wherein the surface of the workpiece comprises at least one flat portion and at least one curved portion;   providing a patterned film, comprising a releasable substrate and an acid-base resistant ink layer disposed on the releasable substrate, wherein a surface of the releasable substrate on which the acid-base resistant ink layer is disposed faces the workpiece;   applying a force to an edge of the patterned film to adhere the patterned film to the flat portion and the curved portion of the surface of the workpiece, so that a pattern on the acid-base resistant ink layer is transferred onto the surface of the workpiece;   removing the releasable substrate;   etching the workpiece and removing the acid-base resistant ink layer; and   performing a second anodized process, so that a dichromatic anode three-dimensional texture is formed on the surface of the workpiece.   
     
     
         2 . The pattern processing method of the workpiece surface as claimed in  claim 1 , wherein the first anodized process is a hard anodized process. 
     
     
         3 . The pattern processing method of the workpiece surface as claimed in  claim 1 , wherein a thickness of a first anode layer formed by the first anodized process is greater than a thickness of a second anode layer formed by the second anodized process. 
     
     
         4 . The pattern processing method of the workpiece surface as claimed in  claim 1 , wherein an acid-base resistance of a first anode layer formed by the first anodized process is greater than an acid-base resistance of a second anode layer formed by the second anodized process. 
     
     
         5 . The pattern processing method of the workpiece surface as claimed in  claim 1 , wherein a scratch resistance of a first anode layer formed by the first anodized process is greater than a scratch resistance of a second anode layer formed by the second anodized process. 
     
     
         6 . The pattern processing method of the workpiece surface as claimed in  claim 1 , further comprising a step of heating the patterned film before adhering the patterned film to the workpiece, so that the patterned film is softened by heat. 
     
     
         7 . The pattern processing method of the workpiece surface as claimed in  claim 1 , wherein a method of adhering the patterned film to the surface of the workpiece is a vacuum suction process. 
     
     
         8 . The pattern processing method of the workpiece surface as claimed in  claim 7 , wherein when performing the vacuum suction process to the workpiece and the patterned film, the edge of the patterned film further adheres to a fixture under the workpiece. 
     
     
         9 . The pattern processing method of the workpiece surface as claimed in  claim 1 , wherein a width of the dichromatic anode texture disposed on the curved portion is slightly greater than a width of the dichromatic anode texture disposed on the flat portion. 
     
     
         10 . The pattern processing method of the workpiece surface as claimed in  claim 1 , wherein there is at least one slit at a position where the patterned film corresponds to the curved portion of the surface of the workpiece. 
     
     
         11 . The pattern processing method of the workpiece surface as claimed in  claim 1 , wherein when etching the workpiece, a portion of the first anode layer not covered by the acid-base resistant ink layer is etched. 
     
     
         12 . The pattern processing method of the workpiece surface as claimed in  claim 1 , wherein the flat portion and the curved portion are connected continually.