Apparatus for Use Downhole Including Devices Having Heat Carrier Channels

Abstract

A method and apparatus for regulating a temperature of a device in a tool used in a wellbore is disclosed. The device generally includes a substrate and a heat source associated with the substrate that induces heat into the substrate. The substrate includes a fluid channel therein. A fluid system provides the fluid into the fluid channel and out of the fluid channel to control the temperature of the component.

1 . An apparatus for use in a downhole tool, comprising:
 a substrate;   a heat source associated with the substrate, the heat source inducing heat into the substrate;   a fluid channel in the substrate; and   a fluid flow unit configured to flow a fluid through the fluid channel to regulate a temperature of the component.   
     
     
         2 . The apparatus of  claim 1 , wherein the fluid flow unit comprises a pump configured to supply the fluid from a storage unit to the channel. 
     
     
         3 . The apparatus of  claim 1  further comprising a heat sink configured to receive fluid from the substrate. 
     
     
         4 . The apparatus of  claim 3 , wherein the heat sink further comprises a thermally conductive element configured to conduct heat from the fluid received from the substrate to a fluid flowing through the tool when the tool is in the wellbore. 
     
     
         5 . The apparatus of  claim 1  further comprising a conduit system configured to provide the fluid into the fluid channel and out of the fluid channel. 
     
     
         6 . The apparatus of  claim 5 , wherein the conduit system provides one of: (i) an open loop path for the fluid; and (ii) a closed loop path for the fluid. 
     
     
         7 . The apparatus of  claim 1 , wherein the heat source is at least one of: (i) a component generating heat when the component is in operation; and (ii) an environment surrounding the substrate. 
     
     
         8 . The apparatus of  claim 1  further comprising a controller configured to regulate the temperature of the component by controlling an operation of one at least one of: (i) a heat sink dissipating heat from the fluid, (ii) a heat sink dissipating heat into the fluid; and (iii) a pump circulating the fluid through the fluid channel. 
     
     
         9 . The apparatus of  claim 8  further comprising a sensor coupled to the substrate configured to provide a temperature measurement of the substrate to the controller to regulate the temperature of the component. 
     
     
         10 . The apparatus of  claim 1 , further comprising a sensor configured to measure a flow rate of the fluid through the fluid channel and provide the flow rate measurement to the controller to regulate the temperature of the component. 
     
     
         11 . A method for regulating a temperature of a device in a tool in a wellbore, comprising:
 providing the device having a substrate having a fluid channel therein in the wellbore;   inducing heat from a heat source into the substrate; and   flowing a fluid through the fluid channel to regulate the temperature of the device.   
     
     
         12 . The method of  claim 11  further comprising providing the fluid to the substrate from a fluid storage unit. 
     
     
         13 . The method of  claim 11  further comprising receiving the fluid from the substrate at a heat sink. 
     
     
         14 . The method of  claim 13 , wherein the heat sink comprises a thermally conductive element and wherein the method further comprising conducting heat from the fluid received from the substrate to a fluid flowing through the tool. 
     
     
         15 . The method of  claim 11  further comprising using a conduit system to provide the fluid into the fluid channel and out of the fluid channel. 
     
     
         16 . The method of  claim 15 , wherein the conduit system provides one of: (i) an open loop path for the fluid; and (ii) a closed loop path for the fluid. 
     
     
         17 . The method of  claim 11 , wherein the heat source is at least one of: (i) a component associated with the substrate generating heat when the component is in operation; and (ii) an environment surrounding the substrate. 
     
     
         18 . The method of  claim 11  further comprising using a controller to regulate the temperature of the component by controlling an operation of one at least one of: (i) a heat sink dissipating heat from the fluid, (ii) a heat sink dissipating heat into the fluid, and (iii) a pump circulating the fluid through the fluid channel. 
     
     
         19 . The method of  claim 18  further comprising providing a temperature measurement of the substrate to the controller from a sensor coupled to the substrate to regulate the temperature of the component. 
     
     
         20 . The method of  claim 18 , further comprising providing a measurement of flow rate of the fluid through the fluid channel the controller to regulate the temperature of the component. 
     
     
         21 . An apparatus, comprising:
 a heat source;   a channel associated with the heat source; and   a device configured to flow a carrier through the channel that absorbs heat from the heat source.   
     
     
         22 . The apparatus of  claim 21  further comprising a medium associated with the carrier configured to absorb heat from the carrier. 
     
     
         23 . The apparatus of  claim 22 , wherein the medium is selected from a group consisting of: a heat sink; a device in thermal communication with the carrier that is at a temperature below the temperature of the carrier; a fluid in thermal communication with the carrier that is at a temperature below the temperature of the carrier.