Thermally conductive gel packs

Abstract

A conformable, thermally-conductive gel pack is provided having a thermal gel encapsulated by a compliant packaging material formed from a dielectric polymer. The gel pack is adapted for emplacement between opposed heat transfer surfaces in an electronic device. One heat transfer surface can be part of a heat-generating component of the device, while the other heat transfer surface can be part of a heat sink or a circuit board.

1 . A conformable thermally-conductive gel pack adapted to be positioned intermediate a first heat transfer surface and an opposing second heat transfer surface to provide a thermal pathway there between, the gel pack comprising a thermally conductive polymeric gel encapsulated in a compliant package comprising a layer of a polymeric material. 
     
     
         2 . The gel pack of  claim 1  wherein one of the first or second heat transfer surfaces is located on a heat-generating source. 
     
     
         3 . The gel pack of  claim 2  wherein:
 the heat-generating source is an electronic component; and 
 the other one of the first or second heat transfer surface is located on a thermal dissipation member. 
 
     
     
         4 . The gel pack of  claim 3  wherein the thermal dissipation member is a heat sink or a circuit board. 
     
     
         5 . The gel pack of  claim 1  wherein the gel comprises a silicone polymer. 
     
     
         6 . The gel pack of  claim 1  wherein the gel is filled with a thermally-conductive particulate filler. 
     
     
         7 . The gel pack of  claim 6  wherein the particulate filler is selected from the group consisting of boron nitride, titanium diboride, aluminum nitride, silicon carbide, graphite, metals, metal oxides, and mixtures thereof. 
     
     
         8 . The gel pack of  claim 6  wherein the filled gel comprises between about 20-80% by weight of the filler. 
     
     
         9 . The gel pack of  claim 6  wherein the filler has a thermal conductivity of at least about 20 W/m-K. 
     
     
         10 . The gel pack of  claim 6  the filled gel has a thermal conductivity of at least about 0.5 W/m-K. 
     
     
         11 . The gel pack of  claim 1  wherein the interface has a thermal impedance of less than about 1° C.-in 2 /W (6° C.-cm 2 /W). 
     
     
         12 . The gel pack of  claim 1  wherein the polymeric material forming the layer of the package is a dielectric. 
     
     
         13 . The gel pack of  claim 1  herein the polymeric material forming the layer of the package is selected from the group consisting of polyimides, polyamides, and copolymers and blends thereof. 
     
     
         14 . A thermal management assembly comprising:
 a first heat transfer surface;   a second heat transfer surface opposing said first heat transfer surface; and a conformable thermally-conductive gel pack disposed intermediate said first and said second heat transfer surfaces to provide a thermally-conductive pathway there between, the gel pack comprising a thermally-conductive polymeric gel encapsulated in a compliant package comprising at least one layer of a polymeric material.   
     
     
         15 . The assembly of  claim 14  wherein one of the first or second heat transfer surfaces is located on a heat-generating source. 
     
     
         16 . The assembly of  claim 15  wherein:
 the heat-generating source is an electronic component; and 
 the other one of the first or second heat transfer surface is located on a thermal dissipation member. 
 
     
     
         17 . The assembly of  claim 16  wherein the thermal dissipation member is a heat sink or a circuit board. 
     
     
         18 . The assembly of  claim 14  wherein the gel comprises a silicone polymer. 
     
     
         19 . The assembly of  claim 14  wherein the gel is filled with a thermally-conductive particulate filler. 
     
     
         20 . The assembly of  claim 19  wherein the particulate filler is selected from the group consisting of boron nitride, titanium diboride, aluminum nitride, silicon carbide, graphite, metals, metal oxides, and mixtures thereof 
     
     
         21 . The assembly of  claim 19  wherein the filled gel comprises between about 20% to about 80% by weight of the filler. 
     
     
         22 . The assembly of  claim 19  wherein the filler has a thermal conductivity of at least about 20 W/m-K. 
     
     
         23 . The assembly of  claim 19  the filled gel has a thermal conductivity of at least about 0.5 W/m-K. 
     
     
         24 . The assembly of  claim 14  wherein the interface has a thermal impedance of less than about 1° C.-in 2 /W (6° C.-cm 2 /W). 
     
     
         25 . The assembly of  claim 14  wherein the polymeric material forming the layer of the package is a dielectric. 
     
     
         26 . The assembly of  claim 14  herein the polymeric material forming the layer of the package is selected from the group consisting of polyimides, polyamides and copolymers and blends thereof