Method for providing a substrate with a printed pattern
Abstract
A machine ( 1 ) is equipped for printing a pattern on a substrate ( 20 ). The machine ( 1 ) comprises a table ( 10 ) for supporting and moving the substrate ( 20 ), and a print head ( 30 ) for firing ink droplets towards the substrate ( 20 ). Further, the machine ( 1 ) comprises a cover plate ( 40 ) which is arranged such as to encompass the print head ( 30 ), wherein the print head ( 30 ) partly extends through a hole in the cover plate ( 40 ). During a printing process, evaporation of solvent which is part of the ink droplets starts as soon as the ink droplets land on the substrate ( 20 ). The presence of the cover plate ( 40 ) has an equalizing effect on the evaporation rate over the printed pattern. As a result, a height distribution of all printed elements of the pattern is within predetermined limits, once the elements have dried up.
Claims
exact text as granted — not AI-modified1 . Method for providing a substrate ( 20 ) with a printed pattern ( 22 ), comprising the following steps: applying a pattern ( 22 ) to the substrate ( 20 ) by means of an ink jet printing process during which a print head ( 30 ) for firing ink droplets ( 32 ) towards the substrate ( 20 ) is used, and during which the print head ( 30 ) and the substrate ( 20 ) are moved with respect to each other; and diminishing a difference between an evaporation rate of an edge portion ( 27 ) of the printed pattern ( 22 ) and an evaporation rate of a centre portion ( 28 ) of the printed pattern ( 22 ) by conditioning the vicinity of at least a portion of the printed pattern ( 22 ).
2 . Method according to claim 1 , comprising the step of covering at least a portion of a vicinity of the printed pattern ( 22 ).
3 . Method according to claim 1 , comprising the step of placing at least a portion of the printed pattern ( 22 ) in a vapour environment.
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