US2011303197A1PendingUtilityA1

Microcondenser device

41
Individually held — no corporate assignee on recordPriority: Jun 9, 2010Filed: Jun 9, 2010Published: Dec 15, 2011
Est. expiryJun 9, 2030(~3.9 yrs left)· nominal 20-yr term from priority
Inventors:Dennis B. Chung
H10N 10/00H10N 10/13F02M 25/0854F02M 33/08B01D 53/0407B01D 53/002B60K 15/03504Y02T10/12F02M 33/02B60K 2015/03514F02M 2025/0863B01D 2259/4516F02M 31/20
41
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Claims

Abstract

A microcondenser device for an evaporative emission control system associated with an internal combustion engine includes a housing having a lower wall and at least one side wall extending upward from the lower wall. The lower wall and the at least one side wall together defining a chamber in the housing. A thermoelectric element is supported by the at least one side wall in spaced relation relative to the lower wall. An inlet is defined in the housing for admitting fuel vapor into the chamber. A condensation outlet is defined in the housing for discharging liquid fuel that is condensed from the fuel vapor in the chamber. A porous heat sink element is received in the chamber for absorbing the fuel vapor admitted through the inlet. The porous heat sink element is in conductive thermal contact with the thermoelectric element.

Claims

exact text as granted — not AI-modified
1 . A microcondenser device for an evaporative emission control system associated with an internal combustion engine, comprising:
 a housing having a lower wall and at least one side wall extending upward from the lower wall, the lower wall and the at least one side wall together define a chamber in the housing;   a thermoelectric element supported by the at least one side wall in spaced relation relative to the lower wall;   an inlet defined in the housing for admitting fuel vapor into the chamber;   a condensation outlet defined in the housing for discharging liquid fuel that is condensed from the fuel vapor in the chamber; and   a porous heat sink element received in the chamber for absorbing the fuel vapor admitted through the inlet, the porous heat sink element in conductive thermal contact with the thermoelectric element.   
     
     
         2 . The microcondenser device of  claim 1  further including at least one support baffle supporting the porous heat sink element in an elevated position from the lower wall and in conductive thermal contact with the thermoelectric element. 
     
     
         3 . The microcondenser device of  claim 1  wherein the porous heat sink element is a carbon foam element having a varying porosity. 
     
     
         4 . The microcondenser device of  claim 1  further including a vapor outlet defined in the housing for discharging uncondensed fuel vapor, the vapor outlet elevated relative to the inlet and the inlet elevated relative to the condensation outlet. 
     
     
         5 . The microcondenser device of  claim 1  further including a heat pipe or a liquid cooling circuit for removing heat from the thermoelectric element. 
     
     
         6 . A microcondenser device for an evaporative emission control system, comprising:
 a housing having an inlet for receiving fuel vapor and a condensation outlet for discharging condensed fuel vapor;   a porous heat sink element disposed in the housing and fluidly interposed between the inlet and the condensation outlet for absorbing the fuel vapor received through the inlet;   a thermoelectric element in thermal contact with the porous heat sink element for removing heat from the fuel vapor absorbed by the porous heat sink element to condense the fuel vapor; and   at least one support baffle supporting the porous heat sink element within the housing.   
     
     
         7 . The microcondenser device of  claim 6  wherein the porous heat sink element is a carbon foam heat sink element. 
     
     
         8 . The microcondenser device of  claim 6  wherein the housing has a vapor outlet for discharging fuel vapor that remains vaporized after passing through the porous heat sink element, the porous heat sink element fluidly interposed between the inlet and the vapor outlet. 
     
     
         9 . The microcondenser device of  claim 8  wherein the housing includes a bottom wall and at least one side wall extending upward from the bottom wall, the thermoelectric element is spaced apart vertically from the bottom wall, the at least one support baffle supports the porous heat sink element in spaced apart relation from the bottom wall. 
     
     
         10 . The microcondenser device of  claim 9  wherein the at least one support baffle urges the porous heat sink element toward the thermoelectric element. 
     
     
         11 . The microcondenser device of  claim 9  wherein the at least one support baffle urges the porous heat sink element into thermal contact with the thermoelectric element. 
     
     
         12 . The microcondenser device of  claim 9  wherein a plenum chamber is formed by the at least one side wall, the at least one support baffle and the porous heat sink element, the plenum chamber extending along substantially an entire width of the porous heat sink element. 
     
     
         13 . The microcondenser device of  claim 12  wherein the porous heat sink element has an increased porosity adjacent the plenum chamber. 
     
     
         14 . The microcondenser device of  claim 9  wherein the porous heat sink element has an increased porosity adjacent a first side of the porous heat sink element disposed adjacent the inlet than a second side adjacent the vapor outlet. 
     
     
         15 . The microcondenser device of  claim 14  wherein the porous heat sink element has an increased porosity adjacent an underside of the porous heat sink element disposed adjacent the condensation outlet than an upper side adjacent the thermoelectric element. 
     
     
         16 . The microcondenser device of  claim 9  wherein the porous heat sink element has an increased porosity adjacent an underside of the porous heat sink element disposed adjacent the condensation outlet than an upper side adjacent the thermoelectric element. 
     
     
         17 . The microcondenser device of  claim 6  wherein the thermoelectric element is nestably received within a recess defined in the housing. 
     
     
         18 . The microcondenser device of  claim 17  wherein the housing includes a bottom wall and at least one side wall extending upward from the bottom wall, the at least one side wall includes a recess defined by a shoulder and face extending upward from the shoulder, the thermoelectric element supported on the shoulder and sized such that at least one peripheral edge of the thermoelectric element is positioned closely adjacent the face. 
     
     
         19 . The microcondenser device of  claim 18  wherein a copper plate is interposed between the porous heat sink element and the thermoelectric element. 
     
     
         20 . The microcondenser device of  claim 1  wherein a copper plate is interposed between the porous heat sink element and the thermoelectric element. 
     
     
         21 . The microcondenser device of  claim 20  wherein a thermal paste is interposed between at least one of: the copper plate and the thermoelectric element or the copper plate and the porous heat sink element. 
     
     
         22 . The microcondenser device of  claim 6  wherein the porous heat sink element has an increased porosity adjacent the inlet than adjacent the condensation outlet. 
     
     
         23 . The microcondenser device of  claim 6  wherein the housing is formed of a plastic material. 
     
     
         24 . The microcondenser device of  claim 6  wherein an insulating layer is disposed one of: around an exterior of the housing or inside the housing around the porous heat sink element. 
     
     
         25 . The microcondenser of  claim 6  further including a heat removal assembly for removing heat from a hot side of the microcondenser element, the heat removal assembly comprising at least one of: a heat pipe or a liquid cooling circuit. 
     
     
         26 . A microcondenser device for an evaporative emission control system, comprising:
 a housing having an inlet for receiving fuel vapor and a condensation outlet for discharging condensed fuel vapor;   a porous heat sink element disposed in the housing and fluidly interposed between the inlet and the condensation outlet for absorbing the fuel vapor received through the inlet;   a thermoelectric element in thermal contact with the porous heat sink element for removing heat from the fuel vapor absorbed by the porous heat sink element to condense the fuel vapor; and   a heat removal assembly in conductive thermal contact with a hot side of the microcondenser element for removing heat therefrom, the heat removal assembly comprising at least one of: a heat pipe or a liquid cooling circuit.

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