Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces

Abstract

Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces are disclosed herein. In one embodiment, an end effector for conditioning a polishing pad includes a member having a first surface and a plurality of contact elements projecting from the first surface. The member also includes a plurality of apertures configured to flow conditioning solution to the polishing pad. The apertures can extend from the first surface to a second surface opposite the first surface. The member can further include a manifold that is in fluid communication with the apertures. In another embodiment, a conditioner for conditioning the polishing pad includes an arm having at least one spray nozzle configured to spray conditioning solution onto the polishing pad and an end effector coupled to the arm. The end effector includes a first surface and a plurality of contact elements projecting from the first surface.

1 . A conditioner for conditioning a polishing pad used in polishing a micro-device workpiece, comprising:
 an end effector including a first surface and a plurality of contact elements projecting from the first surface; and   a spray nozzle proximate to the end effector, the spray nozzle being configured to spray a conditioning solution onto the polishing pad.   
     
     
         2 . The conditioner of  claim 1 , further comprising an arm coupled to the end effector, wherein the spray nozzle is coupled to the arm to dispense the conditioning solution onto the polishing pad. 
     
     
         3 . The conditioner of  claim 1  wherein the spray nozzle is a first spray nozzle configured to spray the conditioning solution in a first direction, wherein the conditioner further comprises an arm coupled to the end effector, the arm having a second spray nozzle configured to spray the conditioning solution in a second direction different than the first direction. 
     
     
         4 . The conditioner of  claim 1  wherein the spray nozzle is a first spray nozzle configured to spray the conditioning solution at a first mean radius, wherein the conditioner further comprises an arm coupled to the end effector, the arm having a second spray nozzle configured to spray the conditioning solution at a second mean radius different than the first mean radius. 
     
     
         5 . The conditioner of  claim 1  wherein the end effector further includes a second surface opposite the first surface, and wherein the spray nozzle is coupled to the second surface. 
     
     
         6 . A conditioner for conditioning a polishing pad used in polishing a micro-device workpiece, comprising:
 an arm including at least one spray nozzle configured to spray a conditioning solution onto the polishing pad; and   an end effector coupled to the arm, the end effector including a first surface and a plurality of contact elements projecting from the first surface.   
     
     
         7 . The conditioner of  claim 6  wherein the at least one spray nozzle comprises a first spray nozzle configured to spray the conditioning solution onto the polishing pad at a first mean radius and a second spray nozzle configured to spray the conditioning solution onto the polishing pad at a second mean radius different than the first mean radius. 
     
     
         8 . The conditioner of  claim 6  wherein the at least one spray nozzle comprises a first spray nozzle configured to spray the conditioning solution onto the polishing pad in a first direction and a second spray nozzle configured to spray the conditioning solution onto the polishing pad in a second direction different than the first direction. 
     
     
         9 . The conditioner of  claim 6  wherein the arm is configured to sweep the end effector across the polishing pad, and wherein the at least one spray nozzle is configured to dispense the conditioning solution across the polishing pad. 
     
     
         10 . An apparatus for conditioning a polishing pad used in polishing micro-device workpieces, comprising:
 a table having a support surface;   a polishing pad coupled to the support surface of the table;   a source of conditioning solution; and   a conditioner including an end effector, a spray nozzle proximate to the end effector, and a drive system coupled to the end effector, the end effector having a first surface and a plurality of contact elements projecting from the first surface, wherein the spray nozzle is operatively coupled to the source of conditioning solution and configured to spray a conditioning solution onto the polishing pad, and wherein the conditioner and/or the table is movable relative to the other to rub the plurality of contact elements against the polishing pad.   
     
     
         11 . The apparatus of  claim 10  wherein the conditioner further includes an arm coupled to the end effector, and wherein the spray nozzle is coupled to the arm to dispense the conditioning solution onto the polishing pad. 
     
     
         12 . The apparatus of  claim 10  wherein the end effector further includes a second surface opposite the first surface, and wherein the spray nozzle is coupled to the second surface. 
     
     
         13 . An apparatus for conditioning a polishing pad used in polishing micro-device workpieces, comprising:
 a table having a support surface;   a polishing pad coupled to the support surface of the table;   a source of conditioning solution; and   a conditioner including an arm, an end effector coupled to the arm, and a drive system coupled to the arm, the arm having at least one spray nozzle operatively coupled to the source of conditioning solution and configured to spray a conditioning solution onto the polishing pad, the end effector having a first surface and a plurality of contact elements projecting from the first surface, wherein the conditioner and/or the table is movable relative to the other to rub the plurality of contact elements against the polishing pad.   
     
     
         14 . The apparatus of  claim 13  wherein the at least one spray nozzle includes a first spray nozzle configured to spray the conditioning solution onto the polishing pad at a first mean radius and a second spray nozzle configured to spray the conditioning solution onto the polishing pad at a second mean radius different than the first mean radius. 
     
     
         15 . The apparatus of  claim 13  wherein the at least one spray nozzle includes a first spray nozzle configured to spray in a first direction and a second spray nozzle configured to spray in a second direction different than the first direction. 
     
     
         16 . The apparatus of  claim 13  wherein the arm is configured to sweep the end effector across the polishing pad, and wherein the at least one spray nozzle is configured to dispense the conditioning solution across the polishing pad. 
     
     
         17 . An apparatus for conditioning a polishing pad used in polishing micro-device workpieces, comprising:
 a table having a support surface;   a polishing pad coupled to the support surface of the table;   a source of conditioning solution;   a micro-device workpiece carrier including a spray nozzle operatively coupled to the source of conditioning solution by a fluid line and configured to flow a conditioning solution onto the polishing pad during conditioning; and   a conditioner including an end effector and a drive system coupled to the end effector, the end effector having a first surface and a plurality of contact elements projecting from the first surface, wherein the conditioner and/or the table is movable relative to the other to rub the plurality of contact elements against the polishing pad.   
     
     
         18 . The apparatus of  claim 17  wherein the micro-device workpiece carrier is movable to flow the conditioning solution across the polishing pad. 
     
     
         19 . The apparatus of  claim 17  wherein the micro-device workpiece carrier is movable with the conditioner to flow conditioning solution onto the polishing pad proximate to the conditioner. 
     
     
         20 . An apparatus for conditioning a polishing pad used in polishing micro-device workpieces, comprising:
 a table having a support surface;   a polishing pad coupled to the support surface of the table;   a fluid arm positioned proximate to the polishing pad, the fluid arm having a first spray nozzle, a second spray nozzle, and a fluid manifold in fluid communication with the first and second spray nozzles, wherein the first spray nozzle is configured to flow a conditioning solution onto the polishing pad at a first mean radius, and wherein the second spray nozzle is configured to flow the conditioning solution onto the polishing pad at a second mean radius different from the first mean radius; and   a conditioner including an end effector and a drive system coupled to the end effector, the end effector having a first surface and a plurality of contact elements projecting from the first surface, wherein the conditioner and/or the table is movable relative to the other to rub the plurality of contact elements against the polishing pad.   
     
     
         21 . The apparatus of  claim 20  wherein the first spray nozzle is configured to flow the conditioning solution at a first flow rate and the second spray nozzle is configured to flow the conditioning solution at a second flow rate different from the first flow rate. 
     
     
         22 . An apparatus for conditioning a planarizing surface of a polishing pad, comprising:
 a source of conditioning solution;   an arm;   an end effector carried by the arm, the end effector having a contact surface and a plurality of abrasive elements projecting from the contact surface; and   a fluid dispenser on the arm and/or the end effector, the fluid dispensor being operatively coupled to the source of conditioning solution by a fluid line.   
     
     
         23 . The apparatus of  claim 22  wherein the fluid dispenser comprises an aperture in the contact surface of the end effector. 
     
     
         24 . The apparatus of  claim 22  wherein the fluid dispenser comprises a spray nozzle on the arm and/or the end effector. 
     
     
         25 . The apparatus of  claim 22  wherein the fluid dispenser is configured to dispense conditioning solution onto the polishing pad proximate to the end effector. 
     
     
         26 . A method for conditioning a polishing pad used in polishing a micro-device workpiece, comprising:
 rubbing a plurality of contact elements on a surface of an end effector against a planarizing surface of the polishing pad; and   flowing a conditioning solution through apertures in the end effector and onto the planarizing surface of the polishing pad.   
     
     
         27 . The method of  claim 26  wherein flowing the conditioning solution comprises disposing the conditioning solution between the surface of the end effector and the polishing pad. 
     
     
         28 . The method of  claim 26  wherein flowing the conditioning solution comprises:
 disposing a first volume of conditioning solution between the polishing pad and the surface of the end effector at a first radius on the polishing pad; and 
 disposing a second volume of conditioning solution between the polishing pad and the surface of the end effector at a second radius different from the first radius on the polishing pad, wherein the second volume is at least approximately equal to the first volume. 
 
     
     
         29 . The method of  claim 26  wherein flowing the conditioning solution comprises:
 disposing conditioning solution having a first concentration of active chemicals between the polishing pad and the surface of the end effector at a first radius on the polishing pad; and 
 disposing conditioning solution having a second concentration of active chemicals between the polishing pad and the surface of the end effector at a second radius different from the first radius on the polishing pad, wherein the second concentration is at least approximately equal to the first concentration. 
 
     
     
         30 . The method of  claim 26  wherein flowing the conditioning solution comprises passing the conditioning solution through a manifold in the end effector. 
     
     
         31 . The method of  claim 26  wherein flowing the conditioning solution comprises passing the conditioning solution through apertures in the surface of the end effector. 
     
     
         32 . The method of  claim 26 , further comprising dispensing conditioning solution from a spray nozzle on an arm coupled to the end effector. 
     
     
         33 . A method for conditioning a polishing pad used in polishing a micro-device workpiece, comprising:
 rubbing a plurality of contact elements of an end effector of a conditioner against a planarizing surface of the polishing pad; and   flowing a conditioning solution through a spray nozzle of the conditioner and onto the planarizing surface of the polishing pad.   
     
     
         34 . The method of  claim 33  wherein flowing the conditioning solution comprises:
 disposing a first volume of conditioning solution between the polishing pad and the end effector at a first radius on the polishing pad; and 
 disposing a second volume of conditioning solution between the polishing pad and the end effector at a second radius different than the first radius on the polishing pad, wherein the second volume is at least approximately equal to the first volume. 
 
     
     
         35 . The method of  claim 33  wherein flowing the conditioning solution comprises:
 disposing conditioning solution having a first concentration of active chemicals between the polishing pad and the end effector at a first radius on the polishing pad; and 
 disposing conditioning solution having a second concentration of active chemicals between the polishing pad and the end effector at a second radius different than the first radius of the polishing pad, wherein the second concentration is at least approximately equal to the first concentration. 
 
     
     
         36 . The method of  claim 33  wherein flowing the conditioning solution comprises disposing the conditioning solution between the end effector and the polishing pad. 
     
     
         37 . The method of  claim 33  wherein the spray nozzle is a first spray nozzle, and wherein flowing the conditioning solution comprises:
 flowing the conditioning solution through the first spray nozzle and onto the polishing pad at a first mean radius; and 
 flowing the conditioning solution through a second spray nozzle and onto the polishing pad at a second mean radius different than the first mean radius. 
 
     
     
         38 . The method of  claim 33  wherein the spray nozzle is a first spray nozzle, and wherein flowing the conditioning solution comprises:
 flowing the conditioning solution through the first spray nozzle in a first direction; and 
 flowing the conditioning solution through the second spray nozzle in a second direction different than the first direction. 
 
     
     
         39 . A method for conditioning a polishing pad used in polishing a micro-device workpiece, comprising:
 rubbing a plurality of contact elements of an end effector against a planarizing surface of the polishing pad; and   flowing a conditioning solution through a spray nozzle of a micro-device workpiece carrier and onto the planarizing surface of the polishing pad.   
     
     
         40 . The method of  claim 39  wherein flowing the conditioning solution comprises sweeping the micro-device workpiece carrier across the polishing pad to dispense conditioning solution across the polishing pad. 
     
     
         41 . The method of  claim 39  wherein flowing the conditioning solution comprises:
 disposing a first volume of conditioning solution between the polishing pad and the end effector at a first radius on the polishing pad; and 
 disposing a second volume of conditioning solution between the polishing pad and the end effector at a second radius different than the first radius on the polishing pad, wherein the second volume is at least approximately equal to the first volume. 
 
     
     
         42 . The method of  claim 39  wherein flowing the conditioning solution comprises:
 disposing conditioning solution having a first concentration of active chemicals between the polishing pad and the end effector at a first radius on the polishing pad; and 
 disposing conditioning solution having a second concentration of active chemicals between the polishing pad and the end effector at a second radius different than the first radius on the polishing pad, wherein the second concentration is at least approximately equal to the first concentration. 
 
     
     
         43 . The method of  claim 39  wherein flowing the conditioning solution comprises disposing the conditioning solution between the end effector and the polishing pad. 
     
     
         44 . A method for conditioning a polishing pad used in polishing a micro-device workpiece, comprising:
 rubbing a plurality of contact elements of an end effector against a planarizing surface of the polishing pad;   flowing conditioning solution through a first spray nozzle of a fluid arm and onto a planarizing surface of the polishing pad at a first mean radius; and   flowing conditioning solution through a second spray nozzle of the fluid arm and onto the planarizing surface of the polishing pad at a second mean radius different than the first mean radius.   
     
     
         45 . The method of  claim 44  wherein:
 flowing the conditioning solution through the first spray nozzle comprises disposing a first volume of conditioning solution between the polishing pad and the end effector at a first radius on the polishing pad; and 
 flowing the conditioning solution through the second spray nozzle comprises disposing a second volume of conditioning solution between the polishing pad and the end effector at a second radius different than the first radius on the polishing pad, wherein the second volume is at least approximately equal to the first volume. 
 
     
     
         46 . The method of  claim 44  wherein:
 flowing the conditioning solution through the first spray nozzle comprises disposing conditioning solution having a first concentration of active chemicals between the polishing pad and the end effector at a first radius on the polishing pad; and 
 flowing the conditioning solution through the second spray nozzle comprises disposing conditioning solution having a second concentration of active chemicals between the polishing pad and the end effector at a second radius different than the first radius on the polishing pad, wherein the second concentration is at least approximately equal to the first concentration. 
 
     
     
         47 . A method for conditioning a polishing pad used in polishing a micro-device workpiece, comprising:
 disposing a first volume of conditioning solution between the polishing pad and an end effector at a first radius proximate to a center of the polishing pad; and   disposing a second volume of conditioning solution between the polishing pad and the end effector at a second radius proximate to a perimeter of the polishing pad, wherein the second volume is at least approximately equal to the first volume.   
     
     
         48 . The method of  claim 47  wherein disposing the first volume of conditioning solution comprises flowing the conditioning solution through apertures in the end effector. 
     
     
         49 . The method of  claim 47  wherein disposing the first volume of conditioning solution comprises flowing the conditioning solution through a spray nozzle proximate to the end effector. 
     
     
         50 . The method of  claim 47  wherein disposing the first volume of conditioning solution comprises flowing the conditioning solution through a spray nozzle coupled to a micro-device workpiece carrier. 
     
     
         51 . A method for conditioning a polishing pad used in polishing a micro-device workpiece, comprising:
 disposing conditioning solution having a first concentration of active chemicals between the polishing pad and an end effector at a first radius proximate to a center of the polishing pad; and   disposing conditioning solution having a second concentration of active chemicals between the polishing pad and the end effector at a second radius proximate to a perimeter of the polishing pad, wherein the second concentration is at least approximately equal to the first concentration.   
     
     
         52 . The method of  claim 51  wherein disposing conditioning solution having the first concentration comprises flowing conditioning solution through apertures in the end effector. 
     
     
         53 . The method of  claim 51  wherein disposing conditioning solution having the first concentration comprises flowing conditioning solution through a spray nozzle proximate to the end effector. 
     
     
         54 . The method of  claim 51  wherein disposing conditioning solution having the first concentration comprises flowing conditioning solution through a spray nozzle coupled to a micro-device workpiece carrier. 
     
     
         55 . A method for conditioning a polishing pad used in polishing a micro-device workpiece, comprising:
 rubbing a plurality of contact elements of an end effector carried by an arm against a planarizing surface of the polishing pad; and   flowing a conditioning solution through a fluid dispenser on the arm and/or the end effector.   
     
     
         56 . The method of  claim 55  wherein flowing the conditioning solution comprises passing the conditioning solution through a spray nozzle and onto the polishing pad. 
     
     
         57 . The method of  claim 55  wherein flowing the conditioning solution comprises passing the conditioning solution through apertures in the end effector. 
     
     
         58 . The method of  claim 55 , further comprising sweeping the end effector across the polishing pad and dispensing the conditioning solution across the polishing pad.